SPST, 1 Func, CMOS, CDIP8,
| Parameter Name | Attribute value |
| Maker | Vishay |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-XDIP-T8 |
| normal position | NO |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum on-state resistance (Ron) | 45 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5,+-15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| Maximum connection time | 175 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 5962-9073702MPA | 5962-9073701MPX | 5962-9073702MPX | 5962-9073703MPA | 5962-9073703MPX | 5962-9073701MPA | |
|---|---|---|---|---|---|---|
| Description | SPST, 1 Func, CMOS, CDIP8, | IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP8, CERAMIC, DIP-8, Multiplexer or Switch | IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP8, CERAMIC, DIP-8, Multiplexer or Switch | SPDT, 1 Func, CMOS, CDIP8, | IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP8, CERAMIC, DIP-8, Multiplexer or Switch | SPST, 1 Func, CMOS, CDIP8, |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP8,.3 | DIP, | DIP, | DIP, DIP8,.3 | DIP, | DIP, DIP8,.3 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPDT | SPST | SPST |
| JESD-30 code | R-XDIP-T8 | R-CDIP-T8 | R-CDIP-T8 | R-XDIP-T8 | R-CDIP-T8 | R-XDIP-T8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum on-state resistance (Ron) | 45 Ω | 35 Ω | 35 Ω | 45 Ω | 35 Ω | 45 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO |
| Maximum connection time | 175 ns | 175 ns | 175 ns | 175 ns | 175 ns | 175 ns |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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