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3-345730-6

Description
SOCKET, DIP40, IC SOCKET
CategoryThe connector    socket   
File Size127KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

3-345730-6 Overview

SOCKET, DIP40, IC SOCKET

3-345730-6 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknown
ECCN codeEAR99
Contact to complete cooperationGOLD FLASH
Contact completed and terminatedTIN LEAD OVER NICKEL
Device slot typeIC SOCKET
Type of equipment usedDIP40
JESD-609 codee0
Manufacturer's serial number345730
Number of contacts40
Base Number Matches1
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3-345730-6 Product Details
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3-345730-6
T E I nternal N umber: 3 - 3 4 5 7 3 0 - 6
Product Highlights:
l
Socket Style = Standard
l
Through Hole C ontact Termination Type
l
2.54 mm C enterline
l
Row-to-Row Spacing = 15.24 mm
l
40 Positions
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Obsolete
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
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None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
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Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Socket Style
= Standard
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Number of Positions
= 40
l
Profile = Standard
l
Frame Style
= Open
l
Leg Style
= Straight
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C omment = Special Labeling TB
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 2.84 [0.112]
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Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
C enterline (mm [in])
= 2.54 [0.100]
l
Row-to-Row Spacing (mm [in])
= 15.24 [0.600]
l
Mount Style
= Vertical
Contact Related Features:
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C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Plating, Mating Area, Material
= Gold Flash
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
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