54AC251FM datasheet, PDF - EEWORLD Datasheet

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54AC251FM: DescriptionMultiplexer, 1-Func, 8 Line Input, CMOS, CDFP16,; Categorylogic logic; File Size365KB，9 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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54AC251FM Overview

Multiplexer, 1-Func, 8 Line Input, CMOS, CDFP16,

54AC251FM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	MULTIPLEXER
MaximumI(ol)	0.012 A
Number of functions	1
Number of entries	8
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	3.3/5 V
Prop。Delay @ Nom-Sup	17 ns
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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54AC251FM Related Products

	54AC251FM	54AC251LM	74ACT251SJ	54AC251DM
Description	Multiplexer, 1-Func, 8 Line Input, CMOS, CDFP16,	Multiplexer, 1-Func, 8 Line Input, CMOS, CQCC20,	Multiplexer, 1-Func, 8 Line Input, CMOS, PDSO16,	Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL16,.3	QCCN, LCC20,.35SQ	SOP, SOP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknow
JESD-30 code	R-XDFP-F16	S-XQCC-N20	R-PDSO-G16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
MaximumI(ol)	0.012 A	0.012 A	0.024 A	0.012 A
Number of functions	1	1	1	1
Number of entries	8	8	8	8
Number of terminals	16	20	16	16
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DFP	QCCN	SOP	DIP
Encapsulate equivalent code	FL16,.3	LCC20,.35SQ	SOP16,.3	DIP16,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	SMALL OUTLINE	IN-LINE
power supply	3.3/5 V	3.3/5 V	5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	NO LEAD	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
Prop。Delay @ Nom-Sup	17 ns	17 ns	11 ns	-
Base Number Matches	1	1	1	-

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