| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | DIE |
| package instruction | DIE-14 |
| Contacts | 14 |
| Reach Compliance Code | _compli |
| Analog Integrated Circuits - Other Types | DPST |
| JESD-30 code | R-XUUC-N14 |
| JESD-609 code | e0 |
| Humidity sensitivity level | 1 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NO |
| Number of channels | 2 |
| Number of functions | 2 |
| Number of terminals | 14 |
| Nominal off-state isolation | 50 dB |
| On-state resistance matching specifications | 5 Ω |
| Maximum on-state resistance (Ron) | 75 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| output | SEPARATE OUTPUT |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Encapsulate equivalent code | DIE OR CHIP |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5,+-15 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 18 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | YES |
| Maximum disconnect time | 125 ns |
| Maximum connection time | 200 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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