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IRKT26/04A

Description
ADD-A-pak-TM GEN V Power Modules
CategoryAnalog mixed-signal IC    Trigger device   
File Size148KB,8 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Download Datasheet Parametric View All

IRKT26/04A Overview

ADD-A-pak-TM GEN V Power Modules

IRKT26/04A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInternational Rectifier ( Infineon )
Parts packaging codeTO-240AA
package instructionFLANGE MOUNT, R-XUFM-X7
Contacts7
Manufacturer packaging codeADD-A-PAK
Reach Compliance Codecompli
Other featuresUL RECOGNISED
Shell connectionISOLATED
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Maximum DC gate trigger current150 mA
Maximum DC gate trigger voltage4 V
Quick connection description2G-2GR
Description of screw terminalsA-K-AK
Maximum holding current200 mA
JEDEC-95 codeTO-240AA
JESD-30 codeR-XUFM-X7
JESD-609 codee0
Maximum leakage current15 mA
On-state non-repetitive peak current490 A
Number of components2
Number of terminals7
Maximum on-state current27000 A
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum rms on-state current42.39 A
Off-state repetitive peak voltage400 V
Repeated peak reverse voltage400 V
surface mountNO
Terminal surfaceTIN LEAD
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger device typeSCR
Bulletin I27130 rev. G 10/02
IRK.26 SERIES
THYRISTOR/ DIODE and
THYRISTOR/ THYRISTOR
Features
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage
ADD-A-pak
TM
GEN V Power Modules
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al
2
0
3
DBC insulator
Heatsink grounded
27 A
Mechanical Description
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage of
Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a solid
Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured without
hard mold, eliminating in this way any possible direct
stress on the leads.
The electrical terminals are secured against axial pull-out:
they are fixed to the module housing via a click-stop feature
already tested and proved as reliable on other IR modules.
Electrical Description
These modules are intended for general purpose
high voltage applications such as high voltage regu-
lated power supplies, lighting circuits, temperature
and motor speed control circuits, UPS and battery
charger.
Major Ratings and Characteristics
Parameters
I
T(AV)
or I
F(AV)
@ 85°C
I
O(RMS)
(*)
I
TSM
@ 50Hz
I
FSM
@ 60Hz
I
2
t
@ 50Hz
@ 60Hz
I
2
√t
V
RRM
range
T
STG
T
J
(*) As AC switch.
IRK.26
27
60
400
420
800
730
8000
400 to 1600
- 40 to 125
- 40 to125
Units
A
A
A
A
A
2
s
A
2
s
A
2
√s
V
o
o
C
C
www.irf.com
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