Quad-Core Intel® Xeon® Processor
5300 Series
Datasheet
September 2007
Order Number: 315569-003
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Copyright © 2005-2007, Intel Corporation
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Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Contents
1
Introduction............................................................................................................... 11
1.1
Terminology ..................................................................................................... 13
1.2
State of Data .................................................................................................... 15
1.3
References ....................................................................................................... 15
Electrical Specifications ............................................................................................... 17
2.1
Front Side Bus and GTLREF ................................................................................ 17
2.2
Power and Ground Lands.................................................................................... 18
2.3
Decoupling Guidelines ........................................................................................ 18
2.3.1 VCC Decoupling...................................................................................... 18
2.3.2 VTT Decoupling ...................................................................................... 18
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 19
2.4
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 19
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 20
2.4.2 PLL Power Supply ................................................................................... 21
2.5
Voltage Identification (VID) ................................................................................ 21
2.6
Reserved, Unused, or Test Signals ....................................................................... 23
2.7
Front Side Bus Signal Groups .............................................................................. 24
2.8
CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 26
2.9
Test Access Port (TAP) Connection....................................................................... 26
2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 26
2.10.1 DC Characteristics .................................................................................. 26
2.10.2 Input Device Hysteresis .......................................................................... 27
2.11 Mixing Processors.............................................................................................. 27
2.12 Absolute Maximum and Minimum Ratings ............................................................. 28
2.13 Processor DC Specifications ................................................................................ 29
2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 29
2.13.2 VCC Overshoot Specification .................................................................... 42
2.13.3 Die Voltage Validation ............................................................................. 43
2.14 AGTL+ FSB Specifications................................................................................... 43
Mechanical Specifications............................................................................................. 47
3.1
Package Mechanical Drawings ............................................................................. 47
3.2
Processor Component Keepout Zones................................................................... 51
3.3
Package Loading Specifications ........................................................................... 51
3.4
Package Handling Guidelines............................................................................... 52
3.5
Package Insertion Specifications.......................................................................... 52
3.6
Processor Mass Specifications ............................................................................. 52
3.7
Processor Materials............................................................................................ 52
3.8
Processor Markings............................................................................................ 53
3.9
Processor Land Coordinates ................................................................................ 53
Land Listing ............................................................................................................... 57
4.1
Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments ........................... 57
4.1.1 Land Listing by Land Name ...................................................................... 57
4.1.2 Land Listing by Land Number ................................................................... 69
Signal Definitions ....................................................................................................... 79
5.1
Signal Definitions .............................................................................................. 79
Thermal Specifications ................................................................................................ 87
6.1
Package Thermal Specifications ........................................................................... 87
6.1.1 Thermal Specifications ............................................................................ 87
6.2
...................................................................................................................... 95
6.2.1 Thermal Metrology ................................................................................. 97
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3
4
5
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Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
3
6.3
6.4
Processor Thermal Features ................................................................................ 98
6.3.1 Thermal Monitor Features........................................................................ 98
6.3.2 Thermal Monitor (TM1) ........................................................................... 98
6.3.3 Thermal Monitor 2 .................................................................................. 99
6.3.4 On-Demand Mode ................................................................................ 100
6.3.5 PROCHOT# Signal ................................................................................ 101
6.3.6 FORCEPR# Signal................................................................................. 101
6.3.7 THERMTRIP# Signal ............................................................................. 102
Platform Environment Control Interface (PECI) .................................................... 102
6.4.1 Introduction ........................................................................................ 102
6.4.2 PECI Specifications ............................................................................... 103
7
Features.................................................................................................................. 105
7.1
Power-On Configuration Options........................................................................ 105
7.2
Clock Control and Low Power States .................................................................. 105
7.2.1 Normal State ....................................................................................... 106
7.2.2 HALT or Extended HALT State ................................................................ 106
7.2.3 Stop-Grant State.................................................................................. 108
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant
Snoop State ........................................................................................ 109
7.3
Enhanced Intel SpeedStep® Technology ............................................................ 109
Boxed Processor Specifications ................................................................................... 111
8.1
Introduction ................................................................................................... 111
8.2
Mechanical Specifications ................................................................................. 113
8.2.1 Boxed Processor Heat Sink Dimensions (CEK) .......................................... 113
8.2.2 Boxed Processor Heat Sink Weight.......................................................... 121
8.2.3 Boxed Processor Retention Mechanism and Heat Sink
Support (CEK) ..................................................................................... 121
8.3
Electrical Requirements .................................................................................... 121
8.3.1 Fan Power Supply (Active CEK) .............................................................. 121
8.3.2 Boxed Processor Cooling Requirements ................................................... 122
8.4
Boxed Processor Contents ................................................................................ 123
Debug Tools Specifications......................................................................................... 125
9.1
Debug Port System Requirements ..................................................................... 125
9.2
Target System Implementation ......................................................................... 125
9.2.1 System Implementation ........................................................................ 125
9.3
Logic Analyzer Interface (LAI) ........................................................................... 125
9.3.1 Mechanical Considerations ..................................................................... 126
9.3.2 Electrical Considerations........................................................................ 126
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9
Figures
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
Input Device Hysteresis ..................................................................................... 27
Quad-Core Intel® Xeon® Processor E5300 Series Load Current versus Time............. 32
Quad-Core Intel® Xeon® Processor X5300 Series and
Load Current versus Time................................................................................... 32
Quad-Core Intel® Xeon® Processor X5365 Series Load Current versus Time ............ 33
Quad-Core Intel® Xeon® Processor L5300 Series Load Current versus Time ............. 33
Quad-Core Intel® Xeon® Processor L5318 Load Current versus Time ...................... 34
Quad-Core Intel® Xeon® Processor E5300 Series VCC Static and
Transient Tolerance Load Lines........................................................................... 35
Quad-Core Intel® Xeon® Processor X5300 Series VCC Static and
Transient Tolerance Load Lines ........................................................................... 36
Quad-Core Intel® Xeon® Processor L5300 Series VCC Static and
Transient Tolerance Load Lines........................................................................... 37
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Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
2-10 Quad-Core Intel® Xeon® Processor X5365 Series VCC Static and
Transient Tolerance Load Lines ........................................................................... 39
2-11 Quad-Core Intel® Xeon® Processor L5318 VCC Static and
Transient Tolerance Load Lines ........................................................................... 41
2-12 VCC Overshoot Example Waveform...................................................................... 43
2-13 Electrical Test Circuit ......................................................................................... 45
2-14 TCK Clock Waveform ......................................................................................... 45
2-15 Differential Clock Waveform................................................................................ 46
2-16 Differential Clock Crosspoint Specification............................................................. 46
3-1
Processor Package Assembly Sketch .................................................................... 47
3-2
Processor Package Drawing (Sheet 1 of 3) ............................................................ 48
3-3
Processor Package Drawing (Sheet 2 of 3) ............................................................ 49
3-4
Processor Package Drawing (Sheet 3 of 3) ............................................................ 50
3-5
Processor Top-side Markings (Example)................................................................ 53
3-6
Processor Land Coordinates, Top View.................................................................. 54
3-7
Processor Land Coordinates, Bottom View............................................................. 55
6-1
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile ........................... 90
6-2
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profiles .......................... 91
6-3
Quad-Core Intel® Xeon® Processor X5365 Series Thermal Profile ........................... 93
6-4
Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile............................ 95
6-5
Quad-Core Intel® Xeon® Processor L5318 Thermal Profile ..................................... 96
6-6
Case Temperature (TCASE) Measurement Location ................................................ 98
6-7
Thermal Monitor 2 Frequency and Voltage Ordering ............................................. 100
6-8
PECI Topology ................................................................................................ 102
6-9
Conceptual Fan Control Diagram For A PECI-Based Platform.................................. 103
7-1
Stop Clock State Machine ................................................................................. 108
8-1
Boxed Quad-Core Intel® Xeon® Processor 5300 Series 1U Passive/3U+
Active Combination Heat Sink (With Removable Fan) ........................................... 111
8-2
Boxed Quad-Core Intel® Xeon® Processor 5300 Series
2U Passive Heat Sink ....................................................................................... 112
8-3
2U Passive Quad-Core Intel® Xeon® Processor 5300 Series Processor
Thermal Solution (Exploded View) ..................................................................... 112
8-4
Top Side Board Keepout Zones (Part 1) .............................................................. 114
8-5
Top Side Board Keepout Zones (Part 2) .............................................................. 115
8-6
Bottom Side Board Keepout Zones..................................................................... 116
8-7
Board Mounting-Hole Keepout Zones ................................................................. 117
8-8
Volumetric Height Keep-Ins .............................................................................. 118
8-9
4-Pin Fan Cable Connector (For Active CEK Heat Sink) ......................................... 119
8-10 4-Pin Base Board Fan Header (For Active CEK Heat Sink)...................................... 120
8-11 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 122
Tables
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
Quad-Core Intel® Xeon® Processor 5300 Series Features ...................................... 12
Core Frequency to FSB Multiplier Configuration ..................................................... 20
BSEL[2:0] Frequency Table ................................................................................ 20
Voltage Identification Definition........................................................................... 22
Loadline Selection Truth Table for LL_ID[1:0] ....................................................... 23
Market Segment Selection Truth Table for MS_ID[1:0] ........................................... 23
FSB Signal Groups............................................................................................. 24
AGTL+ Signal Description Table........................................................................... 25
Non AGTL+ Signal Description Table .................................................................... 25
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
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