EEWORLDEEWORLDEEWORLD

Part Number

Search

IS61LV12816LL-12LQI

Description
128K X 16 STANDARD SRAM, 10 ns, PDSO44
Categorystorage   
File Size102KB,16 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Download Datasheet Parametric Compare View All

IS61LV12816LL-12LQI Overview

128K X 16 STANDARD SRAM, 10 ns, PDSO44

IS61LV12816LL-12LQI Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals44
Maximum operating temperature70 Cel
Minimum operating temperature0.0 Cel
Maximum supply/operating voltage3.63 V
Minimum supply/operating voltage2.97 V
Rated supply voltage3.3 V
maximum access time10 ns
Processing package descriptionPLASTIC, TSOP2-44
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE, THIN PROFILE
surface mountYes
Terminal formGULL WING
Terminal spacing0.8000 mm
terminal coatingTIN LEAD
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelCOMMERCIAL
memory width16
organize128K X 16
storage density2.10E6 deg
operating modeASYNCHRONOUS
Number of digits131072 words
Number of digits128K
Memory IC typeSTANDARD SRAM
serial parallelPARALLEL
IS61LV12816L
IS61LV12816LL
128K x 16 HIGH-SPEED CMOS STATIC RAM
WITH 3.3V SUPPLY
FEATURES
• High-speed access time:
IS61LV12816L: 8, 10 ns
IS61LV12816LL: 12 ns
• Operating Current:
IS61LV12816L: 50mA (typ.)
IS61LV12816LL: 30mA (typ.)
• Stand by Current:
IS61LV12816L: 700µA (typ.)
IS61LV12816LL: 400µA(typ.)
• TTL and CMOS compatible interface levels
• Single 3.3V power supply
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
ISSI
JUNE 2003
®
DESCRIPTION
The
ISSI
IS61LV12816L/IS61LV12816LL is a high-speed,
2,097,152-bit static RAM organized as 131,072 words by
16 bits. It is fabricated using
ISSI
's high-performance
CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields access
times as fast as 8 ns with low power consumption.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs,
CE
and
OE.
The active LOW
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
The IS61LV12816L/IS61LV12816LL is packaged in the
JEDEC standard 44-pin TSOP (Type II), 44-pin LQFP, and
48-pin mini BGA (6mm x 8mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
128Kx16
MEMORY ARRAY
VDD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
I/O
DATA
CIRCUIT
COLUMN I/O
CE
OE
WE
UB
LB
CONTROL
CIRCUIT
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
05/28/03
1

IS61LV12816LL-12LQI Related Products

IS61LV12816LL-12LQI IS61LV12816L IS61LV12816L-8B IS61LV12816L-8LQ IS61LV12816LL IS61LV12816L-10LQ IS61LV12816L-8LQI IS61LV12816LL-12BI IS61LV12816LL-12TI IS61LV12816LL-12T
Description 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44 128K X 16 STANDARD SRAM, 10 ns, PDSO44
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 44 44 44 44 44 44 44 44 44 44
Maximum operating temperature 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel
Minimum operating temperature 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel
Maximum supply/operating voltage 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply/operating voltage 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
maximum access time 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns
Processing package description PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Craftsmanship CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package Size SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
surface mount Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal spacing 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm
terminal coating TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
memory width 16 16 16 16 16 16 16 16 16 16
organize 128K X 16 128K X 16 128K X 16 128K X 16 128K X 16 128K X 16 128K X 16 128K X 16 128K X 16 128K X 16
storage density 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg 2.10E6 deg
operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Memory IC type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
serial parallel PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Number of digits 128K 128K 128K 128K 128K 128K 128K 128K 128K 128K

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2131  1106  2320  279  2382  43  23  47  6  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号