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5962R9572601VXC

Description
NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14
Categorylogic    logic   
File Size207KB,8 Pages
ManufacturerHarris
Websitehttp://www.harris.com/
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5962R9572601VXC Overview

NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14

5962R9572601VXC Parametric

Parameter NameAttribute value
package instructionDFP,
Reach Compliance Codeunknown
seriesHC/UH
JESD-30 codeR-CDFP-F14
JESD-609 codee4
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
propagation delay (tpd)20 ns
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
total dose100k Rad(Si) V
Base Number Matches1

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Description NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14 NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14 NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14 NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, DIE-14 NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14
package instruction DFP, , DIE, DFP, FL14,.3 DIE, , DIP, DIP14,.3 ,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
series HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH
JESD-30 code R-CDFP-F14 R-CDFP-F14 X-XUUC-N14 R-CDFP-F14 X-XUUC-N14 R-CDIP-T14 R-CDIP-T14 R-CDIP-T14
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of functions 4 4 4 4 4 4 4 4
Number of entries 2 2 2 2 2 2 2 2
Number of terminals 14 14 14 14 14 14 14 14
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR UNSPECIFIED RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK UNCASED CHIP FLATPACK UNCASED CHIP IN-LINE IN-LINE IN-LINE
propagation delay (tpd) 20 ns 18 ns 18 ns 20 ns 18 ns 20 ns 20 ns 18 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form FLAT FLAT NO LEAD FLAT NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL UPPER DUAL UPPER DUAL DUAL DUAL
JESD-609 code e4 - - e0 e0 e4 e0 -
Maximum operating temperature 125 °C - 125 °C 125 °C 125 °C 125 °C 125 °C -
Minimum operating temperature -55 °C - -55 °C -55 °C -55 °C -55 °C -55 °C -
encapsulated code DFP - DIE DFP DIE - DIP -
Temperature level MILITARY - MILITARY MILITARY MILITARY MILITARY MILITARY -
Terminal surface GOLD - - Tin/Lead (Sn/Pb) TIN LEAD GOLD Tin/Lead (Sn/Pb) -
total dose 100k Rad(Si) V - - 200k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 200k Rad(Si) V -
Base Number Matches 1 1 1 1 1 1 1 -
Maker - Harris Harris Harris - - Harris Harris
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