RF 1CHIP IC FOR 900Mhz CORDLESS TELEPHONE
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | QFP |
| package instruction | QFP, QFP52,.52SQ |
| Contacts | 52 |
| Reach Compliance Code | unknow |
| JESD-30 code | S-PQFP-G52 |
| length | 10 mm |
| Number of functions | 1 |
| Number of terminals | 52 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP52,.52SQ |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.6 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.45 mm |
| Maximum slew rate | 0.0333 mA |
| Nominal supply voltage | 3.6 V |
| surface mount | YES |
| technology | BICMOS |
| Telecom integrated circuit types | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10 mm |
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