3SMC5.0CA THRU 3SMC170CA
SURFACE MOUNT BI-DIRECTIONAL
GLASS PASSIVATED JUNCTION
SILICON TRANSIENT
VOLTAGE SUPPRESSOR
3000 WATTS, 5.0 THRU 170 VOLTS
by
Specified
STAND-OFF
VOLTAGE
Central
TM
Semiconductor Corp.
DESCRIPTION:
The CENTRAL SEMICONDUCTOR 3SMC5.0CA
Series types are Surface Mount Bi-Directional Glass
Passivated Junction Transient Voltage Suppressors
designed to protect voltage sensitive components
from high voltage transients.
THIS DEVICE IS MANUFACTURED WITH A
GLASS PASSIVATED CHIP FOR OPTIMUM RELI-
ABILITY.
Note: For Uni-directional devices, please refer to the
3SMC5.0A Series data sheet.
MARKING CODE: SEE MARKING CODE ON
ELECTRICAL CHARACTERISTIC TABLE
SYMBOL
PDM
IFSM
TJ, Tstg
UNITS
W
A
°C
SMC CASE
•
This series is UL listed, UL file number E130224
MAXIMUM RATINGS:
(TA=25°C unless otherwise noted)
Peak Power Dissipation (Note 1)
Peak Forward Surge Current (JEDEC Method)
Operating and Storage Junction Temperature
3000
200
-65 to +150
ELECTRICAL CHARACTERISTICS:
(TA=25°C unless otherwise noted)
REVERSE
STAND-OFF
VOLTAGE
VRWM
V
3SMC5.0CA
3SMC6.0CA
3SMC6.5CA
3SMC7.0CA
3SMC7.5CA
3SMC8.0CA
3SMC8.5CA
3SMC9.0CA
3SMC10CA
3SMC11CA
3SMC12CA
3SMC13CA
3SMC14CA
3SMC15CA
3SMC16CA
3SMC17CA
3SMC18CA
3SMC20CA
3SMC22CA
3SMC24CA
3SMC26CA
3SMC28CA
3SMC30CA
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
BREAKDOWN
VOLTAGE
(VBR @ IT)
MIN
V
6.40
6.67
7.22
7.78
8.33
8.89
9.44
10.0
11.1
12.2
13.3
14.4
15.6
16.7
17.8
18.9
20.0
22.2
24.4
26.7
28.9
31.1
33.3
MAX
V
7.25
7.67
8.30
8.95
9.58
10.23
10.82
11.5
12.8
14.0
15.3
16.5
17.9
19.2
20.5
21.7
23.3
25.5
28.0
30.7
33.2
35.8
38.3
TEST
CURRENT
IT
mA
10
10
10
10
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
MAXIMUM
REVERSE
LEAKAGE
IR @ VRWM
μA
2000
2000
1000
400
200
100
50
20
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
V
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
PEAK
PULSE
CURRENT
(Note 1)
IPP
A
326.0
291.3
267.9
250.0
232.6
220.6
208.4
194.8
176.4
184.8
150.6
139.4
129.4
123.0
115.4
106.6
102.8
92.6
84.4
77.2
71.2
66.0
62.0
CIDE
CIDG
CIDK
CIDM
CIDP
CIDR
CIDT
CIDV
CIDX
CIDZ
CIEE
CIEG
CIEK
CIEM
CIEP
CIER
CIET
CIEV
CIEX
CIEZ
CIFE
CIFG
CIFK
TYPE
MARKING
CODE
Notes: (1) Non-repetitive 10x1,000μs pulse
R4 (3-March 2008)
Central
TM
3SMC5.0CA THRU 3SMC170CA
SURFACE MOUNT BI-DIRECTIONAL
GLASS PASSIVATED JUNCTION
SILICON TRANSIENT
VOLTAGE SUPPRESSOR
3000 WATTS, 5.0 THRU 170 VOLTS
Semiconductor Corp.
ELECTRICAL CHARACTERISTICS - Continued:
REVERSE
STAND-OFF
VOLTAGE
VRWM
V
3SMC33CA
3SMC36CA
3SMC40CA
3SMC43CA
3SMC45CA
3SMC48CA
3SMC51CA
3SMC54CA
3SMC58CA
3SMC60CA
3SMC64CA
3SMC70CA
3SMC75CA
3SMC78CA
3SMC85CA
3SMC90CA
3SMC100CA
3SMC110CA
3SMC120CA
3SMC130CA
3SMC150CA
3SMC160CA
3SMC170CA
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
90
100
110
120
130
150
160
170
BREAKDOWN
VOLTAGE
(VBR @ IT)
MIN
V
36.7
40.0
44.4
47.8
50.0
53.3
56.7
60.0
64.4
66.7
71.1
77.8
83.3
86.7
94.4
100.0
111.0
122.0
133.0
144.0
167.0
178.0
189.0
MAX
V
42.2
46.0
51.1
54.9
57.5
61.3
65.2
69.0
74.1
76.7
81.8
89.5
95.8
99.7
108.2
115.5
128.0
140.5
153.0
165.5
192.5
205.0
217.5
IT
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
TEST
CURRENT
MAXIMUM
REVERSE
LEAKAGE
IR @ VRWM
μA
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
V
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103
113
121
126
137
146
162
177
193
209
243
259
275
PEAK
PULSE
CURRENT
(Note 1)
IPP
A
56.2
51.6
46.4
43.2
41.2
38.8
36.4
34.4
32.0
31.0
29.2
26.6
24.8
22.8
20.8
20.6
18.6
16.8
15.6
14.4
12.4
11.6
11.0
CIFM
CIFP
CIFR
CIFT
CIFV
CIFX
CIFZ
CIGE
CIGG
CIGK
CIGM
CIGP
CIGR
CIGT
CIGV
CIGX
CIGZ
CIHE
CIHG
CIHK
CIHM
CIHP
CIHR
TYPE
MARKING
CODE
SMC - CASE - MECHANICAL OUTLINE
R4 (3-March 2008)
Package Details - SMC
Mechanical Drawing
Lead Code:
Reference individual
device datasheet.
Part Marking:
3-6 Character Alpha/Numeric Code
Mounting Pad Geometry
(Dimensions in mm)
Central
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
R1 (10-December 2002)
Package Details - SMC
Tape Dimensions and Orientation
(Dimensions in mm.)
Tape Width: 16mm
* Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-2-A
Direction of Unreeling
Packaging Base
13” Reel =
Bulk =
3,000 pcs. (add TR13 suffix to part number)
100 pcs. (add BK suffix to part number)
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
13”
Quantity
Per Box
39,000
Number of
Reels per Box
13
Box Dimensions
INCH
CM
14x14x8
36x36x20
Shipping Weight
LB
KG
22
10
Ordering Information
•
For devices taped and reeled on 13” reels, add TR13 suffix to part number.
•
For devices bulk packed, add BK suffix to part number.
•
All SMDs are available bulk packed, for prototype and manual placement applications.
Central
R1 (10-December 2002)
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
SMC Case
Pb (lead)-free plating**
Device average mass
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
232.5 mg
Fluctuation margin
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
+/-10%
Material
Component
active device
leadframe
Material
(%wt)
doped Si
copper
1.63%
39.107%
(mg)
3.8
90.92
Si
Cu
Pb
die attach
high temperature
1.875%
solder paste
4.36
Sn
Ag
silica
epoxy resin
EMC
encapsulation*
TBBA
silica
EMC GREEN
56.77 %
132
epoxy resin
Sn
tin lead process
plating**
100% tin process 0.661%
1.419
0.661%
1.419
Pb
Sn
7439-92-1
7440-31-5
0.132%
0.77%
0.335
0.708
1,320
7,700
Proprietary
7440-31-5
17.38%
0.529%
40.408
1.135
173,798
5,290
79-94-7
7631-86-9
0.568 %
39.39%
1.32
91.592
5,680
393,942
56.77%
132
Sb2O3
1309-64-4
0.568%
1.32
5,680
7440-21-3
7440-50-8
7439-92-1
7440-31-5
7440-22-4
7631-86-9
Substance
CAS No.
(%wt)
1.6%
39.107%
1.735%
0.094%
0.047%
38.606%
(mg)
3.8
90.92
4.033
0.218
0.109
89.76
39.6
(ppm)
16,000
391,070
17,350
940
470
386,060
170,320
Substance
Proprietary 17.032%
*EMC GREEN molding compound is Halogen-Free.
**Specify Lead-Free when ordering 100% tin (Pb-free) plating.
Disclaimer
The information provided in this Material Composition data sheet is, to our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
Central
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
R2 (10-March 2008)