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MM908E625ACDWB/R2

Description
8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54
Categorysemiconductor    The embedded processor and controller   
File Size519KB,40 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MM908E625ACDWB/R2 Overview

8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54

MM908E625ACDWB/R2 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals54
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage18 V
Minimum supply/operating voltage8 V
External data bus width0.0
Number of input and output buses17
Line speed8 MHz
Processing package descriptionPLASTIC, SOIC-54
stateDISCONTINUED
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
ADC channelYes
Address bus width0.0
Number of digits8
Maximum FCLK clock frequency32 MHz
Microprocessor typeMICROCONTROLLER
PWM channelYes
ROM programmingFLASH
Freescale Semiconductor, Inc.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Document order number: MM908E625
Rev 3.0, 09/2004
Advance Information
Integrated Quad Half H-Bridge with
Power Supply, Embedded MCU, and
LIN Serial Communication
The 908E625 is an integrated single-package solution that includes a high-
performance HC08 microcontroller with a
SMARTMOS
TM
analog control IC.
The HC08 includes flash memory, a timer, enhanced serial communications
interface (ESCI), an analog-to-digital converter (ADC), serial peripheral
interface (SPI), and an internal clock generator (ICG) module. The analog
control die provides fully protected H-Bridge/high-side outputs, voltage
regulator, autonomous watchdog with cyclic wake-up, and local interconnect
network (LIN) physical layer.
The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design. It is well
suited for the control of automotive mirror, door lock, and light-levelling
applications.
Features
• High-Performance M68HC08EY16 Core
• 16 K Bytes of On-Chip Flash Memory
• 512 Bytes of RAM
• Internal Clock Generation Module
• Two 16-Bit, 2-Channel Timers
• 10-Bit Analog-to-Digital Converter
• Three 2-Terminal Hall-Effect Sensor Input Ports
• One Analog Input with Switchable Current Source
• Four Low R
DS(ON)
Half-Bridge Outputs
• One Low R
DS(ON)
High-Side Output
• 13 Microcontroller I/Os
908E625
Simplified Application Diagram
Simplified Application Diagram
908E625
908E625
LIN
VREFH
VDDA
EVDD
VDD
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
VSUP[1:3]
HB1
M
HB2
HB3
HB4
HS
High-Side
Output
HVDD
H1
H2
H3
PA1
Port A I/Os
Port B I/Os
Port C I/Os
Switchable Internal
V
DD
Output
M
M
908E625
H-BRIDGE POWER SUPPLY
WITH EMBEDDED MCU AND LIN
Freescale Semiconductor, Inc...
DWB SUFFIX
CASE 1400-01
54-TERMINAL SOICWB-EP
ORDERING INFORMATION
Device
MM908E625ACDWB/R2
Temperature
Range (T
A
)
-40°C to 85°C
Package
54 SOIC
WB-EP
4 Half-Bridges
Controlling 3 Loads
Three
2-Terminal Hall-Effect
Sensor Inputs
Analog Input with
Current Source
Microcontroller
Ports
GND[1:2] EP
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Motorola, Inc. 2004
For More Information On This Product,
Go to: www.freescale.com

MM908E625ACDWB/R2 Related Products

MM908E625ACDWB/R2 MM908E625
Description 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54
Number of functions 1 1
Number of terminals 54 54
Maximum operating temperature 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel
Maximum supply/operating voltage 18 V 18 V
Minimum supply/operating voltage 8 V 8 V
External data bus width 0.0 0.0
Number of input and output buses 17 17
Line speed 8 MHz 8 MHz
Processing package description PLASTIC, SOIC-54 PLASTIC, SOIC-54
state DISCONTINUED DISCONTINUED
packaging shape RECTANGULAR RECTANGULAR
Package Size SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
surface mount Yes Yes
Terminal form GULL WING GULL WING
Terminal spacing 0.6500 mm 0.6500 mm
Terminal location DUAL DUAL
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY
Temperature level INDUSTRIAL INDUSTRIAL
ADC channel Yes Yes
Address bus width 0.0 0.0
Number of digits 8 8
Maximum FCLK clock frequency 32 MHz 32 MHz
Microprocessor type MICROCONTROLLER MICROCONTROLLER
PWM channel Yes Yes
ROM programming FLASH FLASH
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