Plerow
TM
ALN0859
Low Noise Amplifier
Features
・
37.5 dB Gain at 859 MHz
・
18 dBm P1dB
・
37 dBm Output IP3
・
0.65 dB Noise Figure
・
Operating at Single 5 V Supply
・
110 mA Current Consumption
Description
The plerow ALN-series is the compactly designed sur-
face-mount module for the use of the LNA with or without
the following gain blocks in the infrastructure equipment of
the mobile wirelss (CDMA, GSM, PCS, PHS, WCDMA,
DMB, WLAN, WiBro, WiMAX), GPS, satellite communica-
tion terminals and so on. It has an exceptional performance
of low noise figure, high gain, high OIP3, and low bias cur-
rent. The stability factor is always kept less than unity over
the application band in order to confirm its unconditionally
stable implementation to the application system environ-
ment. The surface-mount module package including the
completed matching circuit and other components neces-
sary just in case allows very simple and convenient imple-
mentation onto the system board in mass production level.
TM
2-stage Single Type
Specifications
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
S11 / S22
Output P1dB
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
@ CDMA 20FA
Package Type & Size
Unit
MHz
dB
dB
dB
dBm
dB
dBm
mA
V
Ω
dBm
mm
Specification
824 ~ 894
37.5
±
0.5
0.65
37
-14 / -14
18
110
5
50
5
SMT, 13Wx13Lx3.8H
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
1) Measurement conditions are as follows: T = 25°C, V
CC
= 5 V, Freq. = 859 MHz, 50 ohm system.
2) OIP3 is measured with two tones at an output power of +8 dBm / tone separated by 1 MHz.
3) Note: We recommend that the VSWR toward a source and load be less than 1:4 to avoid an unwanted oscillation.
Outline Drawing
plerow
ALN
ASB Inc.
TOP
BOTTOM
Pin Number
3
8
10
Others
Function
RF In
RF Out
+Vcc
Ground
SIDE
: Soldering area
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
:
φ0.4
plated thru holes to
ground plane
(Unit: mm)
1/1
SUGGESTED FOOTPRINT
www.asb.co.kr
August 2005
Embedded System
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