399-100A-305670
Ball Grid Array Circuit Bridge
FEATURES:
•
A cost effective means of upgrading or testing without
changing your PCB layout.
• The Circuit Bridge allows the user to connect existing
BGA signal paths to achieve your desired results.
• Each circuit bridge is a user-defined custom solution.
Simply send us a list of which connections need to be
“shorted”.
• Solder balls on the PCB side enable easy soldering and
interconnection to your existing PCB.
SPECIFICATIONS:
•
Board Material is .062 thick FR-4 with 10 layers.
• Solder Balls are .020 dia Sn/Pb 90/10.
• Operating temperature = 221ºF [105ºC]
MOUNTING CONSIDERATIONS:
• Suggested PCB pad size = .028± .022 dia.
ALL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
Note: Aries specializes in custom design and production. In addition to the stan-
dard products shown on this page, special materials, platings, sizes, and configu-
rations can be furnished, depending on quantities. Aries reserves the right to
change product specifications without notice.
All tolerances ± .005 [.13]
unless otherwise specified
http://www.arieselec.com • info@arieselec.com
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
abc
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
18082
europe@arieselec.com
REV. C
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