HD64F3026FP datasheet, PDF - EEWORLD Datasheet

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HD64F3026FP: DescriptionMicrocontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, QFP-100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，824 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HD64F3026FP Overview

Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, QFP-100

HD64F3026FP Parametric

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	QFP
package instruction	QFP,
Contacts	100
Reach Compliance Code	unknown
Has ADC	YES
Address bus width	24
bit size	16
maximum clock frequency	25 MHz
DAC channel	YES
DMA channel	NO
External data bus width	16
JESD-30 code	R-PQFP-G100
length	20 mm
Number of I/O lines	79
Number of terminals	100
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	3.1 mm
speed	25 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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To all our customers

Regarding the change of names mentioned in the document, such as

Hitachi Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were

transferred to Renesas Technology Corporation on April 1st 2003.

These operations include microcomputer, logic, analog and discrete devices,

and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors,

and other Hitachi brand names are mentioned in the document, these names

have in fact all been changed to Renesas Technology Corp.

Thank you for your understanding. Except for our corporate trademark,

logo and corporate statement, no changes whatsoever have been made to the

contents of the document, and these changes do not constitute any alteration

to the contents of the document itself.

Renesas Technology Home Page: www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Renesas Technology Corp.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Preface

The H8/3024 Series is a high-performance single-chip microcomputer that integrates peripheral

functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal

architecture as its core.

The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable

timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),

a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a

microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and

mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to

changing application specifications and the demands of the transition from initial to full-fledged

volume production.

Note: * F-ZTAT is a trademark of Hitachi, Ltd.

Intended Readership: This manual is intended for users undertaking the design of an application

system using the H8/3024 Series. Readers using this manual require a basic

knowledge of electrical circuits, logic circuits, and microcomputers.

Purpose:

The purpose of this manual is to give users an understanding of the hardware

functions and electrical characteristics of the H8/3024 Series. Details of

execution instructions can be found in the H8/300H Series Programming

Manual, which should be read in conjunction with the present manual.

Using this Manual:

•

For an overall understanding of the H8/3024 Series's functions

Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system

control functions, peripheral functions, and electrical characteristics.

•

For a detailed understanding of CPU functions

Refer to the separate publication H8/300H Series Programming Manual.

Note on bit notation: Bits are shown in high-to-low order from left to right.

•

For a detailed understanding of a register when its name is known

The addresses, bits, and initial values of the registers are summarized in appendix B, Internal

I/O Registers.

Related Material:

The latest information is available at our Web Site. Please make sure that you

have the most up-to-date information available.

(http://www.hitachisemiconductor.com/)

HD64F3026FP Related Products

	HD64F3026FP	HD64F3024TE	HD64F3024F	HD64F3024FP	HD64F3026TE	HD64F3026F
Description	Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, QFP-100	Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, TQFP-100	Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, QFP-100	Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, QFP-100	Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, TQFP-100	Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, QFP-100
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	QFP,	TFQFP,	FQFP,	QFP,	TFQFP,	FQFP,
Contacts	100	100	100	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Has ADC	YES	YES	YES	YES	YES	YES
Address bus width	24	24	24	24	24	24
bit size	16	16	16	16	16	16
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
DAC channel	YES	YES	YES	YES	YES	YES
DMA channel	NO	NO	NO	NO	NO	NO
External data bus width	16	16	16	16	16	16
JESD-30 code	R-PQFP-G100	S-PQFP-G100	S-PQFP-G100	R-PQFP-G100	S-PQFP-G100	S-PQFP-G100
length	20 mm	14 mm	14 mm	20 mm	14 mm	14 mm
Number of I/O lines	79	79	79	79	79	79
Number of terminals	100	100	100	100	100	100
Maximum operating temperature	75 °C	75 °C	75 °C	75 °C	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
PWM channel	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	TFQFP	FQFP	QFP	TFQFP	FQFP
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	3.1 mm	1.2 mm	3.05 mm	3.1 mm	1.2 mm	3.05 mm
speed	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1	1	1	1	1

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