AD562SD/BIN/883B
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | compliant |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.006% |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15,-15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum slew rate | 25 mA |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| AD562SD/BIN/883B | AD562KN/BIN | AD563SD/883B | AD563TD/883B | 5962-01-107-2127 | PM562GV | |
|---|---|---|---|---|---|---|
| Description | AD562SD/BIN/883B | IC IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN, Digital to Analog Converter |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknow | unknown |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| JESD-30 code | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| Maximum linear error (EL) | 0.006% | 0.012% | 0.006% | 0.006% | 0.006% | 0.006% |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | CMOS | CMOS | CMOS | BIPOLAR |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| JESD-609 code | e0 | e0 | e0 | e0 | - | e0 |
| Filter level | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |
| Maximum slew rate | 25 mA | - | 25 mA | 25 mA | 25 mA | - |
| Terminal surface | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Maker | - | ADI | ADI | ADI | ADI | ADI |