OTP ROM, 256X8, 40ns, Bipolar, PDIP24, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 40 ns |
| JESD-30 code | R-PDIP-T24 |
| length | 32.004 mm |
| memory density | 2048 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.715 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 53S281AN | 63S281AJ | 53S281NL | 53S281N | 53S281ANL | 53S281J/883B | |
|---|---|---|---|---|---|---|
| Description | OTP ROM, 256X8, 40ns, Bipolar, PDIP24, PLASTIC, DIP-24 | OTP ROM, 256X8, 28ns, CMOS, CDIP20 | OTP ROM, 256X8, 50ns, Bipolar, PQCC28, PLASTIC, LCC-28 | OTP ROM, 256X8, 50ns, Bipolar, PDIP24, PLASTIC, DIP-24 | OTP ROM, 256X8, 40ns, Bipolar, PQCC28, PLASTIC, LCC-28 | IC 256 X 8 OTPROM, 50 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM |
| Maker | AMD | AMD | AMD | AMD | AMD | AMD |
| Parts packaging code | DIP | DIP | QLCC | DIP | QLCC | DIP |
| package instruction | DIP, | DIP, DIP20,.3 | PLASTIC, LCC-28 | DIP, | QCCJ, | CERAMIC, DIP-24 |
| Contacts | 24 | 24 | 28 | 24 | 28 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Maximum access time | 40 ns | 28 ns | 50 ns | 50 ns | 40 ns | - |
| JESD-30 code | R-PDIP-T24 | R-GDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | - |
| length | 32.004 mm | 32.0675 mm | 11.5062 mm | 32.004 mm | 11.5062 mm | - |
| memory density | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | - |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | - |
| memory width | 8 | 8 | 8 | 8 | 8 | - |
| Number of functions | 1 | 1 | 1 | 1 | 1 | - |
| Number of terminals | 24 | 24 | 28 | 24 | 28 | - |
| word count | 256 words | 256 words | 256 words | 256 words | 256 words | - |
| character code | 256 | 256 | 256 | 256 | 256 | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | 125 °C | 75 °C | 125 °C | 125 °C | 125 °C | - |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
| organize | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | DIP | DIP | QCCJ | DIP | QCCJ | - |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | - |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | - |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 5.715 mm | 5.588 mm | 4.57 mm | 5.715 mm | 4.57 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | NO | NO | YES | NO | YES | - |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - |
| Temperature level | MILITARY | COMMERCIAL EXTENDED | MILITARY | MILITARY | MILITARY | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| Terminal location | DUAL | DUAL | QUAD | DUAL | QUAD | - |
| width | 15.24 mm | 15.24 mm | 11.5062 mm | 15.24 mm | 11.5062 mm | - |
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