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GS820E32AT-150IT

Description
Cache SRAM, 64KX32, 9ns, CMOS, PQFP100, TQFP-100
Categorystorage    storage   
File Size345KB,23 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Download Datasheet Parametric View All

GS820E32AT-150IT Overview

Cache SRAM, 64KX32, 9ns, CMOS, PQFP100, TQFP-100

GS820E32AT-150IT Parametric

Parameter NameAttribute value
MakerGSI Technology
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.B
Maximum access time9 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
length20 mm
memory density2097152 bit
Memory IC TypeCACHE SRAM
memory width32
Number of functions1
Number of terminals100
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX32
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
Base Number Matches1
GS820E32AT/Q-150/138/133/117/100/66
TQFP, QFP
Commercial Temp
Industrial Temp
Features
• FT pin for user configurable flow through or pipelined operation.
• Dual Cycle Deselect (DCD) Operation.
• 3.3V +10%/-5% Core power supply
• 2.5V or 3.3V I/O supply.
• LBO pin for linear or interleaved burst mode.
• Internal input resistors on mode pins allow floating mode pins.
• Default to Interleaved Pipelined Mode.
• Byte write (BW) and/or global write (GW) operation.
• Common data inputs and data outputs.
• Clock Control, registered, address, data, and control.
• Internal Self-Timed Write cycle.
• Automatic power-down for portable applications.
• JEDEC standard 100-lead TQFP or QFP package.
-150
Pipeline tCycle 6.6ns
3-1-1-1 t
KQ
3.8ns
I
DD
270mA
Flow tCycle 10.5ns
Through t
KQ
9ns
2-1-1-1 I
DD
170mA
-138
-133
-117
-100
-66
7.25ns 7.5ns 8.5ns 10ns 12.5ns
4ns
4ns
4.5
5ns
6ns
245mA 240mA 210mA 180mA 150mA
15ns 15ns 15ns 15ns 20ns
9.7ns 10ns 11ns 12ns 18ns
120mA 120mA 120mA 120mA 95mA
64K x 32
2M Synchronous Burst SRAM
Flow Through / Pipeline Reads
150Mhz - 66Mhz
9ns - 18ns
3.3V VDD
3.3V & 2.5V I/O
The function of the Data Output register can be controlled by the user
via the FT mode pin/bump (Pin 14 in the TQFP, bump 1F in the FP-
BGA). Holding the FT mode pin/bump low, places the RAM in Flow
through mode, causing output data to bypass the Data Output
Register. Holding FT high places the RAM in Pipelined Mode,
activating the rising edge triggered Data Output Register.
DCD Pipelined Reads
The GS820E32A is a DCD (Dual Cycle Deselect) pipelined
synchronous SRAM. SCD (Single Cycle Deselect) versions are also
available. DCD SRAMs pipeline disable commands to the same
degree as read commands. DCD RAMs hold the deselect command
for one full cycle and then begin turning off their outputs just after the
second rising edge of clock.
Byte Write and Global Write
Byte write operation is performed by using byte write enable (BW)
input combined with one or more individual byte write signals (Bx). In
addition, Global Write (GW) is available for writing all bytes at one
time, regardless of the Byte Write control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High) of
the ZZ signal, or by stopping the clock (CK). Memory data is retained
during Sleep mode.
Functional Description
Applications
The GS820E32A is a 2,097,152 bit high performance synchronous
SRAM with a 2 bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPU’s, the device now finds application in synchronous
SRAM applications ranging from DSP main store to networking chip
set support.
Core and Interface Voltages
The GS820E32A operates on a 3.3V power supply and all inputs/
outputs are 3.3V and 2.5V compatible. Separate output power (V
DDQ
)
pins are used to de-couple output noise from the internal circuit.
Controls
Addresses, data I/O’s, chip enables (E
1
, E
2
, E
3
), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are
synchronous and are controlled by a positive edge triggered clock
input (CK). Output enable (G) and power down control (ZZ) are
asynchronous inputs. Burst cycles can be initiated with either ADSP
or ADSC inputs. In Burst mode, subsequent burst addresses are
generated internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or interleave order
with the Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Rev: 1.04 3/2000
1/23
© 2000, Giga Semiconductor, Inc.
E
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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