LOC112 is a linear optocoupler for use in telecom, med-
ical and power supply isolation circuits. They are available
in 8 pin DIP, surface mount or flatpack packages.
Applications
•
Modem Transformer Replacement With No
Insertion Loss
•
Digital Telephone Isolation
•
Power Supply Feedback Voltage/Current
•
Medical Sensor Isolation
•
Audio Signal Interfacing
•
Isolation of Process Control Transducers
Approvals
•
UL Recognized: File Number E76270
•
CSA Certified: File Number LR 43639-10
•
BSI Certified:
•
BS EN 60950:1992 (BS7002:1992)
Certificate #:7344
•
BS EN 41003:1993
Certificate #:7344
Ordering Information
Part #
LOC112
LOC112P
LOC112PTR
LOC112S
LOC112STR
Description
8 Pin DIP (50/Tube)
8 Pin Flatpack (50/Tube)
8 Pin Flatpack (1000/Reel)
8 Pin Surface Mount (50/Tube)
8 Pin Surface Mount (1000/Reel)
Pin Configuration
LOC112 Pinout
1
2
3
4
8
7
6
5
Ð LED
+ LED
+V
cc1
I
1
NC
NC
+V
cc2
I
2
DS-LOC112-R2
www.clare.com
1
LOC112
Absolute Maximum Ratings (@ 25
o
C)
Parameter
Input Power Dissipation
Input Control Current
Peak (10ms)
Total Package Dissipation
Isolation Voltage
Input to Output
SOIC Package
Operational Temperature
Storage Temperature
Soldering Temperature
(10 Seconds Max)
Flatpack Package
1
2
Min
-
-
-
-
Typ Max Units
-
-
-
-
150
1
100
1
800
2
mW
mA
A
mW
Absolute Maximum Ratings are stress ratings. Functional
operation of the device at these or any other conditions
beyond those indicated in the operational sections of this
data sheet is not implied. Exposure of the device to the
absolute maximum ratings for an extended period may
degrade the device and effect its reliability.
3750
-40
-40
-
-
-
-
-
-
-
V
RMS
°
C
+85
+125
°
C
+220
°
C
+260
°
C
Derate Linearly 1.33 mW/
°
C
Derate Linearly 6.67 mW/
°
C
Electrical Characteristics
PARAMETER
Input Characteristics @ 25°C1
LED Voltage Drop
Reverse LED Current
Reverse LED Voltage
Forward LED Current
Coupler/Detector
Characteristics @ 25°C
Dark Current
K1, Servo Gain (I
1
/I
F
)
K2, Forward Gain (I
2
/I
F
)
K3, Transfer Gain (K
2
/K
1
)
1
∆K3,
Transfer Gain Linearity
1
(non-servoed)
K3 Temperature Coefficient
Common Mode
Rejection Ratio
Total Harmonic Distortion
Frequency Response
CONDITIONS
I
F
=2-10mA
V
R
=5V
-
-
SYMBOL
V
F
I
R
V
R
I
F
MIN
0.9
-
-
-
TYP
1.2
-
-
-
MAX
1.4
10
5
100
UNITS
V
µA
V
mA
I
F
=0mA, V
CC
=15V
I
F
=2-10mA, V
CC
=15V
I
F
=2-10mA, V
CC
=15V
I
F
=2-10mA, V
CC
=15V
I
F
=2-10mA
I
F
=2-10mA, V
det
=-5V
V=20V
P-P
, R
L
=2KΩ,
F=100Hz
F
O
=350Hz, 0dBm
Photoconductive
Operation
Photovoltaic
Operation
-
I
D
K1
K2
K3
∆K3
∆K3/∆T
CMRR
THD
BW
(-3dB)
BW
(-3dB)
C
I/O
V
I/O
-
0.004
0.004
0.733
-
-
-
-96
-
1
0.007
0.007
1.0
-
0.005
130
-87
200
40
25
0.030
0.030
1.072
1.0
-
-
-80
-
-
-
-
nA
-
-
-%
%/
°
C
dB
dB
kHz
kHz
pF
V
RMS
Input/Output Capacitance
Input/Output Isolation
1
LOC111
-
3750
3
-
and LOC112 Bins D,E,F,G.
K3 Sorted Bins
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
Bin G
Bin H
Bin I
Bin J
=
=
=
=
=
=
=
=
=
=
0.550-0.605
0.606-0.667
0.668-0.732
0.733-0.805
0.806-0.886
0.887-0.974
0.975-1.072
1.073-1.179
1.180-1.297
1.298-1.426
•
•
•
•
The LOC110/LOC111/LOC112 are shipped in anti-static tubes of 50
pieces. Each tube will contain one K3 sorted bin.
Bin designation marked on each device (A-J).
Orders for the LOC110 product will be shipped using bins available at
the date of the order. Any bin (A-J) can be shipped.
For customers requiring selected bins D E F G we offer part num-
bers LOC111 or LOC112.
2
www.clare.com
Rev. 2
LOC112
Performance Data
LOC112
LED Current (I
F
) vs.
LED Forward Voltage (V
F
)
35
100
LOC112
LED Current (I
F
) vs.
LED Forward Voltage (V
F
)
0.014
0.012
LOC112
Servo Gain vs.
LED Current & Temperature
0°C
25°C
50°C
70°C
85°C
30
LED Current (mA)
25
LED Current (mA)
Servo Gain
20
15
10
10
0.010
0.008
0.006
0.004
1
5
0
1
1.1
1.2
1.3
1.4
0.1
1
1.1
1.2
1.3
1.4
0.002
0
0
2
4
6
8
10
12
LED Forward Voltage (V)
LED Forward Voltage (V)
LED Current (mA)
Normalized Servo-Photocurrent
"
Servo-Photocurrent (µA)
LOC112
Servo-Photocurrent vs.
LED Current & Temperature
0°C
25°C
50°C
70°C
85°C
1.4
1.2
LOC112
Normalized Servo-Photocurrent vs.
LED Current & Temperature
0°C
25°C
50°C
70°C
85°C
LED Forward Voltage Drop (V)
1.7
1.6
1.5
1.4
1.3
1.2
LOC112
Typical LED Forward Voltage Drop vs.
Temperature
&
$
"
"
$
&
1.0
0.8
0.6
0.4
20mA
10mA
5mA
1.1
1.0
0.9
-40
-15
10
35
60
85
0.2
0
0
2
4
6
8
10
12
LED Current (mA)
LED Current (mA)
Temperature (°C)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
Rev. 2
www.clare.com
3
LOC112
Mechanical Dimensions
8 Pin DIP Through Hole (Standard)
7.620
±
.254
(.300
±
.010)
3.302
(.130)
9.144 TYP.
(.360)
6.350
±
.127
(.250
±
.005)
9.652
±
.381
(.380
±
.015)
2.540
±
.127
(.100
±
.005)
PC Board Pattern
(Top View)
2.540
±
.127
8-.800 DIA. (.100
±
.005)
(8-.031 DIA.)
7.620
±
.127
(.300
±
.005)
7.239 TYP.
(.285)
9.144
±
.508
(.360
±
.020)
6.350
±
.127
(.250
±
.005)
.457
±
.076
(.018
±
.003)
8.077
±
.127
(.318
±
.005 )
7.620
±
.127
(.300
±
.005)
8 Pin Flatpack (“P” Suffix)
9.652
±
.381
(.380
±
.015)
2.540
±
.127
(.100
±
.005)
PC Board Pattern
(Top View)
2.540
±
.127
(.100
±
.005)
9.398
±
.127
(.370
±
.005)
2.159 TYP.
(.085)
7.620
±
.254
(.300
±
.010)
6.350
±
.127
(.250
±
.005)
.203
(.008)
.457
±
.076
(.018
±
.003)
8.077
±
.127
(.318
±
.005)
1.193
(.047)
2.286 MAX.
.635
±
.127
(.090)
(.025)
8.763
±
.127
(.345
±
.005)
.787
(.031)
8 Pin DIP Surface Mount (“S” Suffix)
7.620
±
.254
(.300
±
.010)
4.445
±
.127
(.175
±
.005)
3.302
(.130)
.635 TYP.
(.025)
.254 TYP.
(.010)
6.350
±
.127
(.250
±
.005)
9.652
±
.381
(.380
±
.015)
2.540
±
.127
(.100
±
.005)
PC Board Pattern
(Top View)
2.540
±
.127
(.100
±
.005)
9.525
±
.254
(.375
±
.010)
1.905
±
.127
(.075
±
.005)
.457
±
.076
(.018
±
.003)
8.077
±
.127
(.318
±
.005)
1.498
±
.127
(.059
±
.005)
8.305
±
.127
(.327
±
.005)
Dimensions
mm
(inches)
4
www.clare.com
Rev. 2
CPC7581
Mechanical Dimensions
Tape and Reel Packaging for 8 Pin Flatpack Package
330.2 DIA.
(13.00)
2.007
±
.102 1.498
±
.102 3.987
±
.102
(.079
±
.004) (.059
±
.004) (.157
±
.004)
Top Cover
Tape Thickness
.102 MAX.
(.004)
6.731 MAX.
1.753
±
0.102
(.265)
(.069
±
.004)
.406 MAX.
(.016)
7.493
±
.102
(.295
±
.004)
1
8
16.002
±
.305
(.630
±
.012)
10.287
(.405)
12.090
(.476)
4.877
(.192)
Embossed Carrier
Top Cover
Tape
.050R TYP.
11.988
±
.102
(.472
±
.004)
User Direction of Feed
10.287
±
.102
(.405
±
.004)
1.549
±
.102
(.061
±
.004)
Embossment
Tape and Reel Packaging for 8 Pin Surface Mount Package
[b]25E[/b] I received it from esp8266, I didn't have much hope at first.I really appreciate the benefits of this forum.I received the stuff, thanks to everyone in this forum.I picked up the phone, com...
The audio signal is input from the ADC input of UDA1341, and then output from the DAC output of 1341. The main purpose is to control the volume\bass\treble\mute of the input signal through 1341, and s...
433MHz is an open carrier frequency band. So far, no wireless ad hoc network solution has been provided by a major international manufacturer in this frequency band. Due to the inherent electromagneti...
[i=s]This post was last edited by paulhyde on 2014-9-15 09:48[/i] [img]http://fmn002.xnimg.cn/fmn002/pic001/20080803/15/54/large_3131i172.jpg[/img] This is a simple voltage divider circuit for measuri...
A multi-point temperature control heating control system was designed using the SST89E564RC single-chip microcomputer and a new temperature measuring device. The heating system can be controlled in...[Details]
my country is a big country in agriculture, grain production and consumption. Grains are a necessary condition for our nation to survive and develop. The flour processing industry will exist forever w...[Details]
This paper designs a 16x16LED Chinese character display bar based on single-chip dynamic scanning control, briefly analyzes the principle of Chinese character display, and studies how the LED displ...[Details]
Liquid crystal display (LCD) panels have a wide range of applications, from small portable electronic devices to large fixed devices, including digital cameras, laptops, personal data assistants, d...[Details]
When the so-called "copycat phones" that flood the domestic mobile phone market move towards large screens, stereo amplifiers, touch controls, and even GPS navigation and mobile TV, the homogeneity...[Details]
1 Introduction
Power supply ripple will interfere with the normal operation of electronic equipment, causing malfunctions such as computer crashes, data processing errors and control system fa...[Details]
Any power transmission and distribution equipment and power-consuming devices cannot be pure resistive loads, so they must occupy a certain amount of reactive power. The existence of reactive curre...[Details]
Today's advanced electronic systems for the telecom and datacom markets rely heavily on high-performance, fine-line digital ICs (FPGAs, DSPs, and/or ASICs) to quickly and efficiently process time-s...[Details]
The high-pressure common rail system consists of a high-pressure fuel pump, a common rail, an injector, an electronic control unit (ECU) and various sensors. The low-pressure fuel pump inputs the fuel...[Details]
Design Considerations
After the long-term deployment of smart meters (automatic meter reading infrastructure), a two-way communication will be established between the utility and the consumer. The ...[Details]
introduction
With the increasing opening and competition of the telecommunications market, operators are facing greater pressure and need to improve investment recovery efficiency and increase...[Details]
Fragment velocity is an important parameter for evaluating the explosive effectiveness of warheads. Traditional range fragment velocity measurement systems mostly use multi-channel data acquisition...[Details]
The growth of Bluetooth over the past five years has been phenomenal. However, in the minds of most consumers, Bluetooth is still a wireless communication medium that connects mobile phones and hea...[Details]
Designing with FPGA, DSP or microprocessor is a critical part of the design and also takes the most time. System-level designers can benefit greatly by focusing their main efforts on system design, an...[Details]
The solution for system RF interface simulation analysis is:
(1) Use the ADS device library to select components such as mixers, bandpass filters, and power amplifiers;
(2) Determine the s...[Details]