Above which useful life may be impaired (Notes 1, 2, 3, 8)
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature ........................................................................................... –55°C to +125°C
V
CC
supply voltage with respect to ground ............................................................................ –0.5 V to +7.0 V
Input signal with respect to ground ........................................................................................ –3.0 V to +7.0 V
Signal applied to high impedance output ............................................................................... –3.0 V to +7.0 V
Output current into low outputs ............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
O
PERATING
C
ONDITIONS
To meet specified electrical and switching characteristics
Mode
Active Operation, Commercial
Active Operation, Military
Temperature Range
(Ambient)
0°C to +70°C
–55°C to +125°C
Supply
Voltage
4.75 V
≤
V
CC
≤
5.25 V
4.50 V
≤
V
CC
≤
5.50 V
E
LECTRICAL
C
HARACTERISTICS
Over Operating Conditions (Note 4)
Symbol
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC1
I
CC2
Parameter
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Current
Output Leakage Current
V
CC
Current, Dynamic
V
CC
Current, Quiescent
(Note 3)
Test Condition
V
CC
= Min.,
I
OH
= –2.0 mA
V
CC
= Min.,
I
OL
= 8.0 mA
Min
2.4
Typ
Max
Unit
V
0.5
2.0
0.0
V
CC
0.8
±20
±20
10
20
1.0
V
V
V
µA
µA
mA
mA
Ground
≤
V
IN
≤
V
CC
(Note 12)
Ground
≤
V
OUT
≤
V
CC
(Note 12)
(Notes 5, 6)
(Note 7)
Multipliers
3
08/16/2000–LDS.112-K
432109876543210987654321
432109876543210987654321
432109876543210987654321
432109876543210987654321
*D
ISCONTINUED
S
PEED
G
RADE
Symbol
Symbol
212109876543210987654321098765432
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
121098765432109876543210987654321
2121098765432109876543210987654321
1
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2121098765432109876543210987654321
2
Min
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
210987654321
10987654321
210987654321
210987654321
2
Min
DEVICES INCORPORATED
S
WITCHING
W
AVEFORMS
M
ILITARY
O
PERATING
R
ANGE
(–55°C to +125°C)
Notes 9, 10 (ns)
C
OMMERCIAL
O
PERATING
R
ANGE
(0°C to +70°C)
Notes 9, 10 (ns)
SWITCHING CHARACTERISTICS
t
DIS
t
ENA
t
D
t
H
t
S
t
PW
t
MC
t
DIS
t
ENA
t
D
t
H
t
S
t
PW
t
MC
INPUT
CLK B
CLK A
R
23-8
OE
Parameter
Parameter
Three-State Output Disable Delay
(Note 11)
Three-State Output Enable Delay
(Note 11)
Output Delay
Input Register Hold Time
Input Register Setup Time
Clock Pulse Width
Clocked Multiply Time
Three-State Output Disable Delay
(Note 11)
Three-State Output Enable Delay
(Note 11)
Output Delay
Input Register Hold Time
Input Register Setup Time
Clock Pulse Width
Clocked Multiply Time
t
S
t
H
t
DIS
HIGH IMPEDANCE
t
MC
4
t
PW
t
ENA
12 x 12-bit Parallel Multiplier
15
20
15
15
3
3
60*
65*
t
PW
Max
Max
25
25
25
60
30
30
30
65
t
D
Min
LMU112–
50
Min
15
20
15
15
3
3
LMU112–
55*
Max
Max
30
30
30
25
25
25
55
50
Multipliers
LMU112
Min
Min
08/16/2000–LDS.112-K
12
10
12
10
3
1
30*
25
Max
Max
25
25
25
20
20
20
30
25
LMU112
DEVICES INCORPORATED
12 x 12-bit Parallel Multiplier
NOTES
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
t
DIS
test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified
I
OH
and
I
OL
at an output
voltage of
V
OH
min and
V
OL
max
2. The products described by this spec- respectively. Alternatively, a diode
ification include internal circuitry de- bridge with upper and lower current
signed to protect the chip from damag-
sources of
I
OH
and
I
OL
respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF
less, conventional precautions should minimum, and may be distributed.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs ca-
avoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
3. This device provides hard clamping of testing of this device. The following
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above
V
CC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
V
CC
+ 0.6 V. The device can withstand installed between
V
CC
and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
tion will not be adversely affected, how- should be installed between device
V
CC
ever, input current levels will be well in and the tester common, and device
ground and tester common.
excess of 100 mA.
4. Actual test conditions may vary from b. Ground and
V
CC
supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
5. Supply current for a given applica- c. Input voltages should be adjusted to
tion can be accurately approximated by: compensate for inductive ground and
V
CC
noise to maintain required DUT input
2
F
NCV
levels relative to the DUT ground pin.
4
where
10. Each parameter is shown as a min-
imum or maximum value. Input re-
quirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the exter-
6. Tested with all outputs changing ev- nal system must supply at least that
ery cycle and no load, at a 5 MHz clock much time to meet the worst-case re-
quirements of all parts. Responses from
rate.
the internal circuitry are specified from
7. Tested with all inputs within 0.1 V of the point of view of the device. Output
V
CC
or Ground, no load.
delay, for example, is specified as a
8. These parameters are guaranteed maximum since worst-case operation of
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