IC 64K X 8 UVPROM, 250 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | WQCCN, LCC32,.45X.55 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 250 ns |
| I/O type | COMMON |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 524288 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.09 mm |
| Maximum standby current | 0.00002 A |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| Base Number Matches | 1 |
| NM27LV512L250 | NM27LV512L200 | NM27LV512LE250 | NM27LV512L300 | NM27LV512V300 | NM27LV512VE250 | NM27LV512V200 | NM27LV512TE250 | |
|---|---|---|---|---|---|---|---|---|
| Description | IC 64K X 8 UVPROM, 250 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM | IC 64K X 8 UVPROM, 200 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM | IC 64K X 8 UVPROM, 250 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM | IC 64K X 8 UVPROM, 300 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 300 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 250 ns, PDSO32, EIAJ, PLASTIC, TSOP1-32, Programmable ROM |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP32,.8,20 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 250 ns | 200 ns | 250 ns | 300 ns | 300 ns | 250 ns | 200 ns | 250 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.995 mm | 13.995 mm | 13.995 mm | 18.4 mm |
| memory density | 524288 bi | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bi |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| organize | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | WQCCN | WQCCN | WQCCN | WQCCN | QCCJ | QCCJ | QCCJ | TSOP1 |
| Encapsulate equivalent code | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | TSSOP32,.8,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.09 mm | 3.09 mm | 3.09 mm | 3.09 mm | 3.56 mm | 3.56 mm | 3.56 mm | 1.2 mm |
| Maximum standby current | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| Maximum slew rate | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | J BEND | J BEND | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.455 mm | 11.455 mm | 11.455 mm | 8 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
京公网安备 11010802033920号
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