NM27LV512VE250 datasheet, PDF - EEWORLD Datasheet

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NM27LV512VE250: DescriptionIC 64K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM; Categorystorage storage; File Size366KB，12 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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NM27LV512VE250 Overview

IC 64K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM

NM27LV512VE250 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	QCCJ, LDCC32,.5X.6
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.995 mm
memory density	524288 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum standby current	0.00002 A
Maximum slew rate	0.015 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.455 mm
Base Number Matches	1

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	NM27LV512VE250	NM27LV512L250	NM27LV512L200	NM27LV512LE250	NM27LV512L300	NM27LV512V300	NM27LV512V200	NM27LV512TE250
Description	IC 64K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM	IC 64K X 8 UVPROM, 250 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM	IC 64K X 8 UVPROM, 200 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM	IC 64K X 8 UVPROM, 250 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM	IC 64K X 8 UVPROM, 300 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM	IC 64K X 8 OTPROM, 300 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM	IC 64K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM	IC 64K X 8 OTPROM, 250 ns, PDSO32, EIAJ, PLASTIC, TSOP1-32, Programmable ROM
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCJ, LDCC32,.5X.6	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	TSOP1, TSSOP32,.8,20
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	250 ns	250 ns	200 ns	250 ns	300 ns	300 ns	200 ns	250 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQCC-J32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-PQCC-J32	R-PQCC-J32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	13.995 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.995 mm	13.995 mm	18.4 mm
memory density	524288 bit	524288 bi	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bi
Memory IC Type	OTP ROM	UVPROM	UVPROM	UVPROM	UVPROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
organize	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	WQCCN	WQCCN	WQCCN	WQCCN	QCCJ	QCCJ	TSOP1
Encapsulate equivalent code	LDCC32,.5X.6	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LDCC32,.5X.6	LDCC32,.5X.6	TSSOP32,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.56 mm	3.09 mm	3.09 mm	3.09 mm	3.09 mm	3.56 mm	3.56 mm	1.2 mm
Maximum standby current	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	NO LEAD	NO LEAD	NO LEAD	NO LEAD	J BEND	J BEND	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.455 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.455 mm	11.455 mm	8 mm
Base Number Matches	1	1	1	1	1	1	-	-

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