P
RODUCT
S
PECIFICATIONS
®
Integrated Circuits Group
LH28F160S3HNS-L10
Flash Memory
16M (2M×8/1Mx16)
(Model No.: LHF16KAS)
Spec No.: EL131052
Issue Date: February 5, 2001
sharp
LHF16KAS
●Handle
this document carefully for it contains material protected by international copyright
law. Any reproduction, full or in part, of this material is prohibited without the express
written permission of the company.
●When
using the products covered herein, please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the company
be liable for any damages resulting from failure to strictly adhere to these conditions and
precautions.
(1) The products covered herein are designed and manufactured for the following
application areas. When using the products covered herein for the equipment listed
in Paragraph (2), even for the following application areas, be sure to observe the
precautions given in Paragraph (2). Never use the products for the equipment listed
in Paragraph (3).
•Office
electronics
•Instrumentation
and measuring equipment
•Machine
tools
•Audiovisual
equipment
•Home
appliance
•Communication
equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment
which demands high reliability, should first contact a sales representative of the
company and then accept responsibility for incorporating into the design fail-safe
operation, redundancy, and other appropriate measures for ensuring reliability and
safety of the equipment and the overall system.
•Control
and safety devices for airplanes, trains, automobiles, and other
transportation equipment
•Mainframe
computers
•Traffic
control systems
•Gas
leak detectors and automatic cutoff devices
•Rescue
and security equipment
•Other
safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands
extremely high performance in terms of functionality, reliability, or accuracy.
•Aerospace
equipment
•Communications
equipment for trunk lines
•Control
equipment for the nuclear power industry
•Medical
equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above
three Paragraphs to a sales representative of the company.
●Please
direct all queries regarding the products covered herein to a sales representative
of the company.
Rev. 2.0
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LHF16KAS
1
CONTENTS
PAGE
1 INTRODUCTION
...................................................... 3
1.1 Product Overview ................................................ 3
2 PRINCIPLES OF OPERATION
................................ 6
2.1 Data Protection ................................................... 7
3 BUS OPERATION....................................................
7
3.1 Read ................................................................... 7
3.2 Output Disable .................................................... 7
3.3 Standby ............................................................... 7
3.4 Deep Power-Down .............................................. 7
3.5 Read Identifier Codes Operation ......................... 8
3.6 Query Operation.................................................. 8
3.7 Write.................................................................... 8
4 COMMAND DEFINITIONS
....................................... 8
4.1 Read Array Command....................................... 11
4.2 Read Identifier Codes Command ...................... 11
4.3 Read Status Register Command....................... 11
4.4 Clear Status Register Command....................... 11
4.5 Query Command............................................... 12
4.5.1 Block Status Register .................................. 12
4.5.2 CFI Query Identification String..................... 13
4.5.3 System Interface Information....................... 13
4.5.4 Device Geometry Definition ......................... 14
4.5.5 SCS OEM Specific Extended Query Table .. 14
4.6 Block Erase Command...................................... 15
4.7 Full Chip Erase Command ................................ 15
4.8 Word/Byte Write Command............................... 16
4.9 Multi Word/Byte Write Command ...................... 16
4.10 Block Erase Suspend Command..................... 17
4.11 (Multi) Word/Byte Write Suspend Command... 17
4.12 Set Block Lock-Bit Command.......................... 18
4.13 Clear Block Lock-Bits Command..................... 18
4.14 STS Configuration Command ......................... 19
8 PACKAGE AND PACKING SPECIFICATION........49
7 ADDITIONAL INFORMATION
................................48
7.1 Ordering Information ..........................................48
6 ELECTRICAL SPECIFICATIONS...........................32
6.1 Absolute Maximum Ratings ...............................32
6.2 Operating Conditions .........................................32
6.2.1 Capacitance .................................................32
6.2.2 AC Input/Output Test Conditions ..................33
6.2.3 DC Characteristics........................................34
6.2.4 AC Characteristics - Read-Only Operations .36
6.2.5 AC Characteristics - Write Operations..........39
6.2.6 Alternative CE#-Controlled Writes ................42
6.2.7 Reset Operations .........................................45
6.2.8 Block Erase, Full Chip Erase, (Multi)
Word/Byte Write and Block Lock-Bit
Configuration Performance...........................46
PAGE
5 DESIGN CONSIDERATIONS
.................................30
5.1 Three-Line Output Control .................................30
5.2 STS and Block Erase, Full Chip Erase, (Multi)
Word/Byte Write and Block Lock-Bit Configuration
Polling................................................................30
5.3 Power Supply Decoupling ..................................30
5.4 V
PP
Trace on Printed Circuit Boards ..................30
5.5 V
CC
, V
PP
, RP# Transitions.................................31
5.6 Power-Up/Down Protection................................31
5.7 Power Dissipation ..............................................31
Rev. 2.0
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LHF16KAS
2
LH28F160S3HNS-L10
16M-BIT (2MBx8/1MBx16)
Smart 3 Flash MEMORY
■
Smart 3 Technology
2.7V or 3.3V V
CC
2.7V, 3.3V or 5V V
PP
■
Common Flash Interface (CFI)
Universal & Upgradable Interface
■
Scalable Command Set (SCS)
■
High Speed Write Performance
32 Bytes x 2 plane Page Buffer
2.7µs/Byte Write Transfer Rate
■
High Speed Read Performance
100ns(3.3V±0.3V), 120ns(2.7V-3.6V)
■
Operating Temperature
-40°C to +85°C
■
Enhanced Automated Suspend Options
Write Suspend to Read
Block Erase Suspend to Write
Block Erase Suspend to Read
■
High-Density Symmetrically-Blocked
Architecture
Thirty-two 64K-byte Erasable Blocks
■
SRAM-Compatible Write Interface
■
User-Configurable x8 or x16 Operation
■
Enhanced Data Protection Features
Absolute Protection with V
PP
=GND
Flexible Block Locking
Erase/Write Lockout during Power
Transitions
■
Extended Cycling Capability
100,000 Block Erase Cycles
3.2 Million Block Erase Cycles/Chip
■
Low Power Management
Deep Power-Down Mode
Automatic Power Savings Mode
Decreases I
CC
in Static Mode
■
Automated Write and Erase
Command User Interface
Status Register
■
Industry-Standard Packaging
56-Lead SSOP
■
ETOX
TM*
V Nonvolatile Flash
Technology
■
CMOS Process
(P-type silicon substrate)
■
Not designed or rated as radiation
hardened
SHARP’s LH28F160S3HNS-L10 Flash memory with Smart 3 technology is a high-density, low-cost, nonvolatile,
read/write storage solution for a wide range of applications. Its symmetrically-blocked architecture, flexible voltage
and extended cycling provide for highly flexible component suitable for resident flash arrays, SIMMs and memory
cards. Its enhanced suspend capabilities provide for an ideal solution for code + data storage applications. For
secure code storage applications, such as networking, where code is either directly executed out of flash or
downloaded to DRAM, the LH28F160S3HNS-L10 offers three levels of protection: absolute protection with V
PP
at
GND, selective hardware block locking, or flexible software block locking. These alternatives give designers
ultimate control of their code security needs.
The LH28F160S3HNS-L10 is conformed to the flash Scalable Command Set (SCS) and the Common Flash
Interface (CFI) specification which enable universal and upgradable interface, enable the highest system/device
data transfer rates and minimize device and system-level implementation costs.
The LH28F160S3HNS-L10 is manufactured on SHARP’s 0.35µm ETOX
TM
* V process technology. It come in
industry-standard package: the 56-Lead SSOP ideal for board constrained applications.
*ETOX is a trademark of Intel Corporation.
Rev. 2.0
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