Flash, 1MX16, 150ns, PBGA64, 8 X 11 MM, PLASTIC, CSP, FBGA-64
| Parameter Name | Attribute value |
| package instruction | 8 X 11 MM, PLASTIC, CSP, FBGA-64 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| Other features | ACCESS TIME 130 NS AT VCC 3.3+/-0.3V |
| Spare memory width | 8 |
| JESD-30 code | R-PBGA-B64 |
| length | 11 mm |
| memory density | 16777216 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Programming voltage | 2.7 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| type | NOR TYPE |
| width | 8 mm |
| Base Number Matches | 1 |
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