MASW-008902-000DIE
Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
Features
•
802.11b/g and Bluetooth Applications
•
Insertion Loss: 0.60 dB typical
•
Isolation:
31 dB typical (R
X
Path)
22 dB typical (T
X
/ BT paths)
•
Flip-chip configuration
•
RoHS* Compliant
Rev. V4
Die Bump Pad Layout (bump side up)
Description
The MASW-008902-000DIE is a bumped single
band GaAs pHEMT MMIC SP3T switch. Typical
applications are for single band 2.4 GHz WLAN
(802.11 b/g) and Bluetooth applications.
The MASW-008902-000DIE delivers high isolation,
low insertion loss, and high linearity at 2.4 - 2.5 GHz.
The MASW-008902-000DIE is fabricated using a 0.5
micron gate length GaAs pHEMT process. The
process features full passivation for performance
and reliability. This die features SnAg (2.5%) solder
bumps for WLCSP applications.
Die Bump Pad Configuration
Name
V
C
1
BT
GND
T
X
Description
Voltage Control 1
Blue Tooth T
X
/R
X
Port
Ground
2.5 GHz T
X
Port
Voltage Control 3
2.5 GHz R
X
Port
Voltage Control 2
Antenna Port
Ordering Information
Part Number
MASW-008902-000DIE
MASW-008902-000D3K
MASW-008902-001SMB
1,2
V
C
3
R
X
Package
V
C
2
RFC
Separated Die on Grip Ring
Die in 3000 piece reel
Sample Board SP3T
Absolute Maximum Ratings
3,4
Parameter
Input Power @ 3 V Control
Input Power @ 5 V Control
Operating Voltage
Operating Temperature
Storage Temperature
Absolute Maximum
+32 dBm
+35 dBm
+8 volts
-40°C to +85°C
-65°C to +150°C
1. Die quantity varies.
2. Die on Grip Ring not available with orientation mark.
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
*
Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-008902-000DIE
Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
Electrical Specifications
5
: T
A
= 25°C, Z
0
= 50
Ω,
V
C
= 0/3V, P
IN
= 0 dBm
Parameter
Insertion Loss
Isolation
Return Loss
IP3
Input P1dB
Test Conditions
RFC to T
X
/R
X
/BT, 2.4 GHz
RFC to T
X
, 2.4 GHz
RFC to R
X
, 2.4 GHz
RFC to BT, 2.4 GHz
2.4 - 2.5 GHz
RF to T
X
/R
X
/BT, 2.4 GHz, 20 dBm Total Power, 1 MHz Spacing
RF to T
X
, 2.4 - 2.5 GHz
RF to R
X,
2.4 - 2.5 GHz
RF to BT, 2.4 - 2.5 GHz
RF to T
X
, 2.4 - 2.5 GHz, 20 dBm
50% control to 90% RF
50% control to 10% RF
|V
C
| = 3 V
Units
dB
dB
dB
dBm
dBm
Min.
—
20
30
20
—
—
—
—
—
—
—
—
—
Typ.
0.60
23.5
31.0
21.0
15
55
32
28
32
-75
165
25
<1
Max.
0.75
—
—
—
—
—
—
—
—
—
—
—
10
Rev. V4
Harmonics
Switching Speed
Control Current
dBm
ns
µA
5. External blocking capacitors on all RF ports.
Recommended PCB Configuration
Truth Table
6,7,8
V
C
1
1
0
0
V
C
2
0
1
0
V
C
3
0
0
1
RFC–BT RFC-T
X
On
Off
Off
Off
On
Off
RFC-R
X
Off
Off
On
6. For positive voltage control, external DC blocking capacitors
are required on all RF ports.
7. Differential voltage, V(state 1) - V(state 0), must be
+2.7 V minimum and must not exceed +5 V.
8. 0 = 0 ± 0.3 V, 1 = +2.7 V to +5 V.
Handling Procedures
Parts List
Part
C1 - C4
C5 - C7
Value
39 pF
1000 pF
Case Style
0402
0402
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-008902-000DIE
Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
Product Consistency Distribution Charts
9
(on wafer RF test)
LB
Rev. V4
P r o c e s s C a p a b ility
P ro c e s s D a ta
LB
0
T a rg e t
*
U S L
0 .7 5
S a m p le M e a n
0 .5 8 9 9 3 7
O v e r a ll C a p a b ili t y
P pk
0 .8 2
P r o c e s s C a p a b ility
U S L
LS L
P ro c e s s D
LS L
T a rg e t
S a m p le M e a n
a ta
30
*
3 1 .2 2 7 6
O v e ra ll C a p a b ilit y
P pk
0 .87
-0 . 0
0 .1
0 .2
0 .3
0 .4
0 .5
0 .6
0 .7
28
29
30
31
32
33
34
35
36
37
38
In s e r t i o n L o s s - A l l P a t h s ( d B )
R x Is o la tio n ( d B )
P r o c e s s C a p a b ility
LS L
P ro c e s s D a ta
LS L
20
T a rg e t
*
S a m p le M e a n 2 3 . 5 1 5 7
O v e ra ll C a p a b ilit y
P pk
3 .9 9
P ro ess C apabi
Process
c
Capability
l i t y
P rocess D ata
LS L
20
T arget
*
S ample M ean 21.2414
O v erall C apability
P pk
1.73
LSL
18
19
20
21
22
23
24
25
26
27
28
18
19
20
21
22
23
T x Is o la tio n ( d B )
Bluet oot h Isolat ion (dB)
LB
P r o c e s s C a p a b ility
U S L
P ro ce s s D a ta
LB
0
T a rg e t
*
U S L
2
S a m p le M e a n
0 .3 5 3 6 5 5
O v e ra ll C a p a b ilit y
P pk
2 .3 3
0 .0
S w itc h C u r r e n t - A ll P a th s ( u A )
0 .3
0 .6
0 .9
1 .2
1 .5
1 .8
9. Represents >50 wafers, tested per electrical specifications: Freq. = 2.4 GHz, T
A
= 25°C, Z
0
= 50
Ω,
V
C
= 0/3V, P
IN
= 0 dBm
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-008902-000DIE
Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
Typical Performance Curves (plots = chip on board assembly)
T
X
Insertion Loss
0.85
+25°C
-40°C
+85°C
Rev. V4
T
X
Isolation
35
0.80
30
+25°C
-40°C
+85°C
0.75
25
0.70
20
0.65
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
R
X
Insertion Loss
0.85
+25°C
-40°C
+85°C
R
X
Isolation
35
0.80
30
0.75
25
+25°C
-40°C
+85°C
0.70
20
0.65
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
BT Insertion Loss
0.85
BT Isolation
35
0.80
+25°C
-40°C
+85°C
30
+25°C
-40°C
+85°C
0.75
25
0.70
20
0.65
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-008902-000DIE
Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
Die Dimensions (Top and Side Views)
PCB Top Metal / Solder Mask
Rev. V4
Die Bump Pad Layout - Top View
(bump side up)
Die Bump Pad Layout - Bottom View
(bump side down - as installed on board)
10.Orientation mark is only on material that is shipped in tape and
reel. The mark is not available on die shipped on grip ring.
5
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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