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SN54ACT8997 |
5962-9323901Q3A |
5962-9323901QXA |
SNJ54ACT8997FK |
SNJ54ACT8997JT |
SN74ACT8997 |
| Description |
SN54ACT8997 Scan Path Linkers With 4-Bit Identification Buses |
Scan Path Linkers With 4-Bit Identification Buses 28-LCCC -55 to 125 |
Scan Path Linkers With 4-Bit Identification Buses 28-CDIP -55 to 125 |
Scan Path Linkers With 4-Bit Identification Buses 28-LCCC -55 to 125 |
Scan Path Linkers With 4-Bit Identification Buses 28-CDIP -55 to 125 |
SN74ACT8997 Scan Path Linkers With 4-Bit Identification Buses Scan-Controlled TAP Concatenators |
| Brand Name |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
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| Parts packaging code |
- |
QLCC |
DIP |
QLCC |
DIP |
- |
| package instruction |
- |
QCCN, LCC28,.45SQ |
DIP, DIP28,.3 |
QCCN, LCC28,.45SQ |
DIP-28 |
- |
| Contacts |
- |
28 |
28 |
28 |
28 |
- |
| Reach Compliance Code |
- |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
- |
| Factory Lead Time |
- |
1 week |
6 weeks |
6 weeks |
6 weeks |
- |
| JESD-30 code |
- |
S-CQCC-N28 |
R-GDIP-T28 |
S-CQCC-N28 |
R-GDIP-T28 |
- |
| length |
- |
11.43 mm |
36.83 mm |
11.43 mm |
36.83 mm |
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| Number of terminals |
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28 |
28 |
28 |
28 |
- |
| Maximum operating temperature |
- |
125 °C |
125 °C |
125 °C |
125 °C |
- |
| Minimum operating temperature |
- |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
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| Package body material |
- |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, GLASS-SEALED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, GLASS-SEALED |
- |
| encapsulated code |
- |
QCCN |
DIP |
QCCN |
DIP |
- |
| Encapsulate equivalent code |
- |
LCC28,.45SQ |
DIP28,.3 |
LCC28,.45SQ |
DIP28,.3 |
- |
| Package shape |
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SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
- |
| Package form |
- |
CHIP CARRIER |
IN-LINE |
CHIP CARRIER |
IN-LINE |
- |
| Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| power supply |
- |
5 V |
5 V |
5 V |
5 V |
- |
| Certification status |
- |
Qualified |
Qualified |
Not Qualified |
Not Qualified |
- |
| Filter level |
- |
MIL-PRF-38535 Class Q |
MIL-PRF-38535 Class Q |
MIL-PRF-38535 |
MIL-PRF-38535 |
- |
| Maximum seat height |
- |
2.03 mm |
5.08 mm |
2.03 mm |
5.08 mm |
- |
| Maximum slew rate |
- |
0.1 mA |
0.1 mA |
0.1 mA |
100 mA |
- |
| Maximum supply voltage |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
| Minimum supply voltage |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
- |
| Nominal supply voltage |
- |
5 V |
5 V |
5 V |
5 V |
- |
| surface mount |
- |
YES |
NO |
YES |
NO |
- |
| technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
- |
| Temperature level |
- |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
- |
| Terminal form |
- |
NO LEAD |
THROUGH-HOLE |
NO LEAD |
THROUGH-HOLE |
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| Terminal pitch |
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1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
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| Terminal location |
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QUAD |
DUAL |
QUAD |
DUAL |
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| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| width |
- |
11.43 mm |
7.32 mm |
11.43 mm |
7.62 mm |
- |
| uPs/uCs/peripheral integrated circuit type |
- |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
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