5962-9669108HYC datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9669108HYC

5962-9669108HYC: DescriptionStandard SRAM, 128KX8, 25ns, CMOS, DIP-32; Categorystorage storage; File Size176KB，30 Pages; ManufacturerWhite Microelectronics

Download Datasheet Parametric View All

5962-9669108HYC Overview

Standard SRAM, 128KX8, 25ns, CMOS, DIP-32

5962-9669108HYC Parametric

Parameter Name	Attribute value
package instruction	DIP-32
Reach Compliance Code	unknown
Maximum access time	25 ns
JESD-30 code	R-XDIP-T32
JESD-609 code	e4
length	41.91 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Package body material	UNSPECIFIED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

Added device type11. Change limits for I

and I

CCDR1

in table I.

Add: note to paragraph 1.2.2 and table I, conditions. Add device types

12 through 17. Add vendor CAGE code 0EU86. Add condition D to

paragraphs 4.2.a.1 and 4.3.3.b.1. Changes to table I and dimensions

to case outlines T, U, X, Y, and Z. Table I, add note 3 to C

and C

OUT

Add case outline N.

Updated drawing to latest requirements. -sld

DATE (YR-MO-DA)

98-06-22

01-03-01

APPROVED

K. A. Cottongim

Raymond Monnin

01-03-21

06-03-07

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Gary Zahn

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil/

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, MEMORY, DIGITAL, CMOS,

SRAM, 128K x 8-BIT, MONOLITHIC SILICON

DRAWING APPROVAL DATE

96-10-30

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-96691

5962-E298-06

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this

drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific

exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as

designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The

manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as

defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not

affect the form, fit, or function of the device for the applicable device class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38534 and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-96691

SHEET

DSCC FORM 2234

APR 97

3.2.5 Block diagram(s). The block diagram(s) shall be as specified on figure 6.

3.2.6 Output load circuit. The output load circuit used to test product shall be equivalent to the circuit specified on figure 7.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as

specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests

for each subgroup are described in table I.

3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with

the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,

for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those

which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be

made available to the preparing activity (DSCC-VA) upon request.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets

the performance requirements of MIL-PRF-38534 and herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

fit, or function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:

Burn-in test, method 1015 of MIL-STD-883.

(1)

Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control and

shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015

of MIL-STD-883.

as specified in accordance with table 1 of method 1015 of MIL-STD-883.

(2)

Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests

prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-96691

SHEET

DSCC FORM 2234

APR 97

Recommended Resources

Up-adjustable regulated power supply circuit

SL314 sensitive temperature control lamp

Switching regulator circuit diagram composed of SG3524

Automatically shut off stair light control circuit

Multi-channel switching transmitter driver display circuit

Computer motherboard circuit diagram 815 3_04

Chip S3C2410, why does the address variable of the time have to be compared with a hexadecimal address first?: The S3C2410 chip assigns the address value in the chip before processing the date and time, and then operates a negated hexadecimal such as rBCDYEAR = rBCDYEAR &~ (0xff). g_nYear is a date entered by ...; 我是特种兵 Embedded System

WINCE driver loading time: Hello everyone; I have seen that the bootloader on some products will output the time required for a certain driver to load, such as: intilize uart1 driver time is 20ms. May I ask how this time is cal...; Leong Embedded System

Received DIM3517, some complaints: I received the DIM3517 development board with great excitement, but I was shocked when I opened it. It only had the core board + baseboard + CD, without any accessories, including the LCD. I was so de...; chenzhufly ARM Technology

LPC800 series microcontroller GPIO position assignment tool: Here is some more information. If some computers cannot open it, you need to add Java tools, which can be downloaded online.Java tools:[[i] This post was last edited by zhaojun_xf on 2013-7-8 09:51[/i...; zhaojun_xf NXP MCU

Does anyone know how to open a .brd file with AD?: Does anyone know how to open a .brd file with AD? I have tried the method on the Internet but still can't find the solution. I don't know if it is a version issue....; 曹伟1993 PCB Design

Solve the problem of flashing S5pv210 android system VFS: Can't find ext4 filesystem: 这几天烧写S5pv210 的SDMMC 启动的android系统，发现看到信息有提示 [2.181488] EXT4-fs (mmcblk0p2): mounted filesystem with ordered data mode. Opts: (null) [2.191716] EXT4-fs (mmcblk0p2): re-mounted. Opts: (null) [b][color=#8...; Wince.Android Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components