5962-9679601HYC datasheet, PDF

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5962-9679601HYC: DescriptionEEPROM, 128KX8, 300ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32; Categorystorage storage; File Size111KB，21 Pages; ManufacturerWhite Microelectronics

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5962-9679601HYC Overview

EEPROM, 128KX8, 300ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32

5962-9679601HYC Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, DIP-32
Reach Compliance Code	unknown
Maximum access time	300 ns
JESD-30 code	R-CDIP-T32
JESD-609 code	e4
length	42.415 mm
memory density	1048576 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	5.13 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Maximum write cycle time (tWC)	10 ms
Base Number Matches	1

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REVISIONS

LTR

Added device type 06. -sld

Figure 1; case outline X changed the dimension A min and max from

.150 inches and .166 inches to .106 inches and .156 inches.

Changed dimension A1 min and max from .005 inches and .025

inches to .040 inches and .060 inches. Changed dimension b min and

max from .016 inches and .020 inches to .015 inches and .019

inches. Changed dimension E min and max from .437 inches and

.435 inches to .425 inches and .435 inches. -sld

Figure 1; Case outline Y, corrected the max limit for dimensions D

and D1 in the conversion table . Updated drawing to the latest MIL-

PRF-38534 requirements. -sld

DESCRIPTION

DATE (YR-MO-DA)

99-03-10

00-05-05

APPROVED

K. A. Cottongim

Raymond Monnin

01-09-14

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Gary Zahn

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, MEMORY, 128K X 8-BIT,

ELECTRICALLY ERASABLE PROGRAMMABLE READ

ONLY MEMORY, MONOLITHIC SILICON

DRAWING APPROVAL DATE

96-10-21

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-96796

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E628-01

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as

designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.

Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).

Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not

perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device

class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38534 and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4, 5, 6, and 7.

3.2.5 Block diagram. The block diagram shall be as specified on figure 8.

3.2.6 Output load circuit. The output load circuit shall be as specified on figure 9.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

SIZE

REVISION LEVEL

5962-96796

SHEET

DSCC FORM 2234

APR 97

3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available

upon request.

3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked

with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot

sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for

those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer

and be made available to the preparing activity (DSCC-VA) upon request.

3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets

the performance requirements of MIL-PRF-38534 and herein.

3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This

reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the

reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of

program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept

under document control and shall be made available upon request of the acquiring or preparing activity.

3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall

be done for initial characterization and after any design process change which may affect data retention. The methods and

procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military

temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of

the acquiring or preparing activity.

4. QUALITY ASSURANCE PROVISIONS

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the

form, fit, or function as described herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

SIZE

REVISION LEVEL

5962-96796

SHEET

DSCC FORM 2234

APR 97

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