5962-9318701HXC datasheet, PDF

5962-9318701HXC: DescriptionSRAM Module, 512KX8, 120ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size369KB，12 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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5962-9318701HXC Overview

SRAM Module, 512KX8, 120ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
package instruction	1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	120 ns
Other features	USER CONFIGURABLE AS 128K X 32
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	30.1 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	6.22 mm
Maximum standby current	0.0016 A
Minimum standby current	2 V
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	30.1 mm
Base Number Matches	1

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