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5962-9318705HUC

Description
SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size369KB,12 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9318705HUC Overview

SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

5962-9318705HUC Parametric

Parameter NameAttribute value
package instruction1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time55 ns
Other featuresUSER CONFIGURABLE AS 128K X 32
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CPGA-P66
JESD-609 codee4
length30.1 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height6.22 mm
Maximum standby current0.0116 A
Minimum standby current2 V
Maximum slew rate0.6 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
width30.1 mm
Base Number Matches1
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