LD-201 Series
LED displays
Flat displays
LD-201 Series
The LD-201 series were designed in response to the
need for small, flat displays. These are single-chip, flat
displays with high luminance.
!
External Dimensions
(Units : mm)
5.58
3.8±0.1
6.73±0.1
6.0±0.1
3.18
3.68±0.1
1.7
1.7
0.38
Pin No.1 2
(2.5)
Cathode cut
2.5±1.0
!
Selection guide
Emitting color
Type
Red
LD-201VR
Orange
LD-201DU
∗
Yellow
LD-201YY
∗
Green
LD-201MG
∗
Order-based production.
!
Absolute maximum ratings
(Ta=25°C)
Parameter
Power dissipation
Forward current
Peak forward
current
Reverse voltage
Operating
temperature
Storage
temperature
Symbol
P
D
I
F
I
FP
V
R
Topr
Tstg
Red
LD-201VR Orange LD-201DU Yellow LD-201YY
60
20
60
∗
3
60
20
60
∗
3
−25∼+75
−30∼+85
60
20
60
∗
3
Green LD-201MG
75
25
60
∗
3
Unit
mW
mA
mA
V
˚C
˚C
∗
Pulse width 1ms duty 1 / 5
24.0Min.
!Features
1) Planar emission from a single chip.
2) Thin outer casing, multiple units can be coupled
together.
3) Long leads are suitable for a wide range of mounting
options.
5.7±0.1
Cathode mark
0.6
0.5
6.3±0.1
Pin No.1
2
0.6
0.5
Tolerances are ±0.3 unless otherwise noted :
LD-201 Series
LED displays
!
Electrical and optical characteristics
(Ta=25°C)
Parameter
Forward voltage
Reverse current
Peak wavelength
Spectral line half
width
Symbol Conditions
V
F
I
R
I
F
=10mA
V
R
=3V
I
F
=10mA
I
F
=10mA
Red
−
−
−
−
−
−
−
−
Orange
−
−
−
−
Yellow
−
−
−
−
Green
Unit
V
µA
nm
nm
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
2.0
−
650
40
2.8
10
−
−
2.0
−
610
40
2.8
10
−
−
2.1
−
585
40
2.8
10
−
−
2.1
−
563
40
2.8
10
−
−
λ
P
∆λ
Electrical and optical are guaranteed values per element.
!
Luminous intensity vs. wavelength
1.0
Green
0.8
0.6
0.4
0.2
0
500
Yellow
Orange
Red
Axial Luminous Intensity
550
600
650
700
750
Wavelength :
λ
P
(
nm)
!
Luminous intensity
Color
Red
Orange
Yellow
Green
Type
LD-201VR
LD-201DU
LD-201YY
LD-201MG
Min.
2.2
2.2
1.4
3.6
Typ.
6.3
6.3
4.0
10
Max.
−
−
−
−
Unit
mcd
mcd
mcd
mcd
Note1: Measured at I
F
= 10mA
!
Operation notes
When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and
ensure that the inside of the LED is not subjected to mechanical stress while it is hot.