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54LS26J03

Description
NAND Gate, TTL, CDIP14,
Categorylogic    logic   
File Size69KB,1 Pages
ManufacturerRaytheon Company
Websitehttps://www.raytheon.com/
Download Datasheet Parametric Compare View All

54LS26J03 Overview

NAND Gate, TTL, CDIP14,

54LS26J03 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristicsOPEN-COLLECTOR
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Schmitt triggerNO
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

54LS26J03 Related Products

54LS26J03 54LS26J 54LS26W03 54LS26W 74LS26NA+1 74LS26NA+2
Description NAND Gate, TTL, CDIP14, NAND Gate, TTL, CDIP14, NAND Gate, TTL, CDFP14, NAND Gate, TTL, CDFP14, NAND Gate, TTL, PDIP14, NAND Gate, TTL, PDIP14,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DFP, FL14,.3 DFP, FL14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDIP-T14 R-XDFP-F14 R-XDFP-F14 R-PDIP-T14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 70 °C 70 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C - -
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR
Package body material CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DFP DFP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 FL14,.3 FL14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE FLATPACK FLATPACK IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Schmitt trigger NO NO NO NO NO NO
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES NO NO
technology TTL TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Base Number Matches 1 1 - - 1 1
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