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287-1AB

Description
Heat Sinks TO-220 VERT W/TABS
CategoryThermal management products    Heat resisting bracing   
File Size2MB,23 Pages
ManufacturerWakefield-Vette
Websitehttp://www.wakefield-vette.com/
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287-1AB Overview

Heat Sinks TO-220 VERT W/TABS

287-1AB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWakefield-Vette
Reach Compliance Codecompliant
Main materialALUMINUM
colorBLACK
structureFIN
fin directionTRANSVERSE
Surface layerANODIZED
high30 mm
length25.4 mm
Heat Resistant Support Device TypeHEAT SINK
weight4.08 g
width12.7 mm
WTS001_p1-25
6/14/07
10:54 AM
Page 22
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
20
250
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
217-36CTE6
.360 (9.1)
217-36CTTE6
.360 (9.1)
217-36CTRE6
.360 (9.1)
Material: Copper, Matte Tin Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
DDPAK DEVICE
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Tab dT, C
Device Power Dissipation. W
KEY:
í
Device only, NC
v
Device + HS, NC
Device + HS, 100 lfm
„
Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
TAPE DETAILS
REEL DETAILS
Dimensions: in.
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