5962-8946201MZC datasheet, PDF

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5962-8946201MZC: DescriptionMicroprocessor, 16-Bit, 8MHz, CMOS, LCC-68; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，38 Pages; ManufacturerThales Components Corp.

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5962-8946201MZC Overview

Microprocessor, 16-Bit, 8MHz, CMOS, LCC-68

5962-8946201MZC Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	QFP,
Contacts	68
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	23
bit size	16
boundary scan	NO
maximum clock frequency	8 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-XQFP-G68
JESD-609 code	e4
length	24.13 mm
low power mode	NO
Number of terminals	68
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	3.175 mm
speed	8 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	24.13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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TS68C000

LOW POWER HCMOS 16/32 BIT MICROPROCESSOR

April 1999

1/38

5962-8946201MZC Related Products

	5962-8946201MZC	5962-8946201MYA	5962-8946201MYC	5962-8946201MUC	5962-8946201MXA
Description	Microprocessor, 16-Bit, 8MHz, CMOS, LCC-68	Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64	Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64	Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68	Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68
Parts packaging code	QFP	DIP	DIP	PGA	LCC
package instruction	QFP,	DIP,	DIP,	PGA,	QCCN,
Contacts	68	64	64	68	68
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Address bus width	23	23	23	23	23
bit size	16	16	16	16	16
boundary scan	NO	NO	NO	NO	NO
maximum clock frequency	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
External data bus width	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO
JESD-30 code	S-XQFP-G68	R-CDIP-T64	R-CDIP-T64	S-CPGA-P68	S-CQCC-N68
JESD-609 code	e4	e0	e4	e4	e0
low power mode	NO	NO	NO	NO	NO
Number of terminals	68	64	64	68	68
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP	DIP	DIP	PGA	QCCN
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK	IN-LINE	IN-LINE	GRID ARRAY	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
speed	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	GOLD	TIN LEAD	GOLD	GOLD	TIN LEAD
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	PIN/PEG	NO LEAD
Terminal location	QUAD	DUAL	DUAL	PERPENDICULAR	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Base Number Matches	1	1	1	1	1

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