Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 64 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Address bus width | 23 |
| bit size | 16 |
| boundary scan | NO |
| maximum clock frequency | 8 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-CDIP-T64 |
| JESD-609 code | e4 |
| low power mode | NO |
| Number of terminals | 64 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| speed | 8 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | GOLD |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
| 5962-8946201MYC | 5962-8946201MYA | 5962-8946201MUC | 5962-8946201MXA | 5962-8946201MZC | |
|---|---|---|---|---|---|
| Description | Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64 | Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, LCC-68 |
| Parts packaging code | DIP | DIP | PGA | LCC | QFP |
| package instruction | DIP, | DIP, | PGA, | QCCN, | QFP, |
| Contacts | 64 | 64 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Address bus width | 23 | 23 | 23 | 23 | 23 |
| bit size | 16 | 16 | 16 | 16 | 16 |
| boundary scan | NO | NO | NO | NO | NO |
| maximum clock frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| External data bus width | 16 | 16 | 16 | 16 | 16 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO |
| JESD-30 code | R-CDIP-T64 | R-CDIP-T64 | S-CPGA-P68 | S-CQCC-N68 | S-XQFP-G68 |
| JESD-609 code | e4 | e0 | e4 | e0 | e4 |
| low power mode | NO | NO | NO | NO | NO |
| Number of terminals | 64 | 64 | 68 | 68 | 68 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| encapsulated code | DIP | DIP | PGA | QCCN | QFP |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | GRID ARRAY | CHIP CARRIER | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | GOLD | TIN LEAD | GOLD | TIN LEAD | GOLD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG | NO LEAD | GULL WING |
| Terminal location | DUAL | DUAL | PERPENDICULAR | QUAD | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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