Light Touch Switches/EVQQX
6 mm Square SMD Light Touch Switches
Type:
EVQQX
■
Features
●
External dimensions: 6.2 mm 6.2 mm,
Height 2.0 mm, 2.5 mm, 3.1 mm
●
Reflow soldering
●
Wide product variety
■
Recommended Applications
●
Operation switches for portable electronic equipment
(Camcorders, Portable audio players, etc.)
●
Operating signal input switches for communication
equipment.
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
E
V
Product Code
Q
Q
Type
X
Height
Push Plate Color
■
Product Chart
Soldering
Type with Push Plate
Packaging
Ground terminal
Profile
L
Reflow soldering
Without sealing film
Taping
L=2.0, 2.5, 3.1 mm
Without
1.3 N
1.6 N
2.6 N
EVQQXP
EVQQXS
EVQQXT
With
EVQQXM
EVQQXN
EVQQXK
Operating
Force
■
Specifications
Type
Rating
Contact Resistance
Electrical
Insulation Resistance
Dielectric Withstanding Voltage
Bouncing
Operating Force
Travel
Endurance
Operating Life
Operating Temperature
Storage Temperature
Minimum Quantity/Packing Unit
Quantity/Carton
Note: Non washable
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Snap action / Push-on type SPST
10 µA 2 Vdc to 20 mA 15 Vdc (Resistive load)
50 m
50 M
max.
min. (at 100 Vdc)
250 Vac for 1 minute
3 ms max. (ON)
8 ms max. (OFF)
1.3 N±0.4 N
1.6 N±0.5 N
0.25 mm±0.10 mm
1000000 cycles min.
–20 °C to +70 °C
–40 °C to +85 °C (Bulk)
–20 °C to +60 °C (Taping)
H=2.0 mm
H=2.5 mm, 3.1 mm
H=2.0 mm
H=2.5 mm, 3.1 mm
4000 pcs. Embossed Taping (Reel Pack)
2000 pcs. Embossed Taping (Reel Pack)
20000 pcs.
10000 pcs.
100000 cycles min.
2.6 N± 0.6 N
Mechanical
Apr. 2008
Light Touch Switches/EVQQX
■
Dimensions in mm (not to scale)
EVQQX
(Embossed Taping)
6.2±0.3
4
0.8
–0.1
A
B
0
6.8±0.3
Notes:
1.
Non-washable in solvents
2.
Types with ground terminal
available
6.5±0.3
With push plate
Surface mount
For reflow soldering
With ground terminal
Without ground terminal
φ
3
.6
H
φ
3
Knob
A'
0.05±0.1
B'
2
1.3
1
2
1 min.
R0.3
1 min.
(3.2)
(3.3)
1 min.
1 min.
½
4
A'
B'
Height
H
2.0±0.2
2.5±0.2
+0.3
PWB land pattern for reference
(3.2)
(3.6)
A
3.3
B
Circuit Diagram
Even though the ground terminal is not soldered the ground effect would be gained.
However when soldering the ground terminal, do investigation sufficiently beforehand in the
invasion of the flux. We recommend to connect the GND land shown in the switch spec with
the GND of your P.W.B for withstanding electric static discharge.
½
This land not necessary when a ground terminal is not used.
3.1
−0.1
Part Numbers
EVQQXP01W
EVQQXP02W
EVQQXP03W
EVQQXS01W
EVQQXS02W
EVQQXS03W
EVQQXT01W
EVQQXT02W
EVQQXT03W
EVQQXM01W
EVQQXM02W
EVQQXM03W
EVQQXN01W
EVQQXN02W
EVQQXN03W
EVQQXK01W
EVQQXK02W
EVQQXK03W
Ground Terminal Operating Force
Without
Without
Without
Without
Without
Without
Without
Without
Without
With
With
With
With
With
With
With
With
With
1.3 N
1.3 N
1.3 N
1.6 N
1.6 N
1.6 N
2.6 N
2.6 N
2.6 N
1.3 N
1.3 N
1.3 N
1.6 N
1.6 N
1.6 N
2.6 N
2.6 N
2.6 N
H=Height
2.0 mm
2.5 mm
3.1 mm
2.0 mm
2.5 mm
3.1 mm
2.0 mm
2.5 mm
3.1 mm
2.0 mm
2.5 mm
3.1 mm
2.0 mm
2.5 mm
3.1 mm
2.0 mm
2.5 mm
3.1 mm
Push Plate Color
White
White
White
White
White
White
White
White
White
White
White
White
White
White
White
White
White
White
Operating Life
1000000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
100000 cycles
100000 cycles
100000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
1000000 cycles
100000 cycles
100000 cycles
100000 cycles
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2008
Light Touch Switches/EVQQX
■
Recommended Reflow Soldering Conditions
●
Embossed Carrier Taping
MAX.
260
Operation Top (°C)
230
180
150
Fan or Normal Temp.
Tape width=12.0 mm
t
1
Feeding hole
φD
0
A
B
F
W
P
1
Tape running direction
Unit: mm
P
0
4.0±0.1
D
0
Dia.
1.5
–0
+0.1
Chip pocket
P
2
P
0
E
(Normal Temp.)
90±30
Soldering Time (s)
40±10
t
2
Chip component
Part No.
EVQQX
Height
2.0
2.5/3.1
A
7.0±0.2
B
7.5±0.2
W
12.0±0.3
F
5.5±0.1
E
1.75±0.10
P
1
8.0±0.1
P
2
2.0±0.1
t
1
0.30±0.05
t
2
2.2±0.2
3.2±0.2
●
Standard Reel Dimensions in mm (not to scale)
T
E
C
B
Item
A
B
C
D
φ21.0±1.0
r
1.0±0.5
E
2.0±0.5
Rate (mm)
φ370.0±2.0 φ50.0
min.
φ13.0±0.5
Item
W
T
—
t
1.0 to 3.0
r
D
Rate (mm) 14.0±1.5
A
W
t
■
Recommended Shape of Test Pole
■
Recommended Operating Conditions
0.3 mm max.
φ2.0
to
φ3.0
Leaning angle range
90
°±4 °
(vertical direction)
Test pole
Switch
R0.2±0.05
Mounting surface
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Nov. 2007
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