5962-8680505XX datasheet, PDF - EEWORLD Datasheet

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5962-8680505XX: DescriptionUVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40; Categorystorage storage; File Size93KB，16 Pages; ManufacturerWaferscale Integration Inc.

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5962-8680505XX Overview

UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40

5962-8680505XX Parametric

Parameter Name	Attribute value
package instruction	0.600 INCH, WINDOWED, CERDIP-40
Reach Compliance Code	unknown
Maximum access time	150 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T40
length	52.455 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Number of functions	1
Number of terminals	40
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	LCC44,.65SQ
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.72 mm
Maximum standby current	0.00012 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Added four device types and updated format. Added two vendors

CAGE 1FN41 and 34649.

Changes in accordance with NOR 5962-R212-92.

Changes in accordance with NOR 5962-R301-92.

Changes in accordance with NOR 5962-R227-94.

Updated format to include QML vendor paragraphs. ksr

Boilerplate update, part of 5 year review. ksr

DATE (YR-MO-DA)

91-03-27

92-05-15

92-09-05

94-07-05

00-07-24

06-05-31

APPROVED

M. A. Frye

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN CHANGED

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

CHECKED BY

Raymond Monnin

APPROVED BY

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

Michael A Frye

STANDARD

MICROCIRCUIT

DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS 64K X 16 UV EPROM,

MONOLITHIC SILICON

SIZE

SHEET

CAGE CODE

DRAWING APPROVAL DATE

26 MAY89

REVISION LEVEL

67268

1 OF

5962-86805

DSCC FORM 2233

APR 97

5962-E451-06

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-

38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These

modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-

38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535, appendix A and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table(s).

3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing

shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be programmed by

the manufacturer prior to test in a checkerboard or similar pattern (a minimum of 50 percent of the total number of bits

programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed.

3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as

specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-86805

SHEET

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN

number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

3.10 Processing EPROMs. All testing requirements and quality assurance provisions herein shall be satisfied by the

manufacturer prior to delivery.

3.10.1 Erasure of EPROMs. When specified, devices shall be erased in accordance with the procedure and characteristics

specified in 4.4 herein.

3.10.2 Programmability of EPROMs. When specified, devices shall be programmed to the specified pattern using the

procedures and characteristics specified in 4.5 herein.

3.10.3 Verification of erasure and/or programmability of EPROMs. When specified, devices shall be verified as either

programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup

7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device

failure, and shall be removed from the lot.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,

appendix A.

4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices

prior to quality conformance inspection. The following additional criteria shall apply:

a. Burn-in test (method 1015 of MIL-STD-883).

(1) Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1015 of MIL-STD-883.

(2) T

= +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests

prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-86805

SHEET

5962-8680505XX Related Products

	5962-8680505XX	5962-8680505QA	5962-8680504QX	5962-8680504XX	5962-8680506QX	5962-8680505QX	5962-8680506XX	5962-8680505XC
Description	UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 90ns, CMOS, CDIP40, CERAMIC, DIP-40	UVPROM, 64KX16, 170ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 120ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 150ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 120ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 90ns, CMOS, CQCC44, CERAMIC, LCC-44
package instruction	0.600 INCH, WINDOWED, CERDIP-40	CERAMIC, DIP-40	0.600 INCH, WINDOWED, CERDIP-40	WINDOWED, CERAMIC, LLCC-44	WINDOWED, CERAMIC, LLCC-44	WINDOWED, CERAMIC, LLCC-44	0.600 INCH, WINDOWED, CERDIP-40	CERAMIC, LCC-44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	150 ns	90 ns	170 ns	170 ns	120 ns	150 ns	120 ns	90 ns
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	S-CQCC-N44	S-CQCC-N44	S-CQCC-N44	R-GDIP-T40	S-CQCC-N44
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	40	40	40	44	44	44	40	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP	DIP	WDIP	WQCCN	WQCCN	WQCCN	WDIP	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE
Package form	IN-LINE, WINDOW	IN-LINE	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	QUAD
Base Number Matches	1	1	1	1	1	1	1	1
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	-
length	52.455 mm	-	52.455 mm	16.535 mm	16.535 mm	16.535 mm	52.455 mm	-
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Encapsulate equivalent code	LCC44,.65SQ	-	DIP40,.6	LCC44,.65SQ	DIP40,.6	DIP40,.6	LCC44,.65SQ	-
power supply	5 V	-	5 V	5 V	5 V	5 V	5 V	-
Filter level	38535Q/M;38534H;883B	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883
Maximum seat height	5.72 mm	-	5.72 mm	3.3 mm	3.3 mm	3.3 mm	5.72 mm	-
Maximum standby current	0.00012 A	-	0.00012 A	0.00012 A	0.00012 A	0.00012 A	0.00012 A	-
Maximum slew rate	0.06 mA	-	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	-
Terminal pitch	2.54 mm	-	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	-
width	15.24 mm	-	15.24 mm	16.535 mm	16.535 mm	16.535 mm	15.24 mm	-

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