OS-CON
Line-up
Guidelines and
precautions for use
Series system
diagram
Image of
case size
Products list
Packing
specifications
（SMD type）
Packing
specifications
（Radial lead type）
Recommended
soldering
condition
Radial lead
type
SEPC
Series
Condition
(V)
(V)
(％)
−
Room temperature
−
120Hz/20℃
120Hz/20℃
Rated voltage applied, after 2 minutes
100kHz to 300kHz/20℃
Based the value at
100kHz, ＋20℃
−55℃ Z/Z
20℃
＋105℃ Z/Z
20℃
△C/C
DF
ESR
LC
△C/C
Update
RoHS compliance
Small size • Low profile • Super low ESR
Large capacitance • 105℃ 5,000h
Selection guide
SEPC is designed to have even lower ESR than the SEP series.
Suitable for use on computer and peripheral products such as motherboards,
servers and VGAs. Lead free-flow is supported.
※2
Specifications
Items
Rated voltage
Surge voltage
Capacitance tolerance
Dissipation Factor (DF)
Leakage current
※1
Equivalent series resistance (ESR)
Characteristics of impedance
ratio at high temp.
and low temp.
Technical data
Specifications
2.5
3.3
4.0
5.2
6.3
8.2
−55 to ＋105
M : ±20
Please see the attached characteristics list
Please see the attached characteristics list
Please see the attached characteristics list
0.75 to 1.25
0.75 to 1.25
Within ±20% of the initial value
Within 1.5 times of the initial limit
Within 1.5 times of the initial limit
Within the initial limit
Within ±20% of the initial value
Within 1.5 times of the initial limit
Within 1.5 times of the initial limit
Within the initial limit (after voltage processing)
Within ±5% of the initial value
Within the initial limit
Within the initial limit
Within the initial limit (after voltage processing)
10
12
16
18
Fundamental
structure
Characteristics
Reliability
SVPF
Category temperature range (℃)
SVPS
SVPD
SVPC
SVPB
SVPA
SVQP
SVP
Surface mount type
SVPE
Endurance
105℃, 5,000h,
Rated voltage applied
Radial lead type
SEPF
SEPC
SEPC
SEQP
SEP
Damp heat(Steady state)
60℃, 90%RH,
1,000h,
No-applied voltage
DF
ESR
LC
△C/C
DF
ESR
LC
Catalog Deletion and
EOL series
Resistance to soldering heat
※2
POSCAP
Line-up
Guidelines and
precautions for use
Series system
diagram
Image of
case size
Products list
Explanation of
part numbers
Packing
specifications
Marking
Flow method
(260±5℃ X 10s)
※1 In case of some problems for measured values, measure after applying rated voltage for 120 minutes at 105℃.
afte
※2 Please refer to page 26 for flow soldering conditions.
Selection guide
Marking and dimensions
Polarity marking
（Cathode）
E12, E13, F13 Size
Case No.
φd
（＋）
B9, C55, C6, C7, C9, E7, E9 Size
φd
（＋）
F
φD
F
15min
L
19min
4min
B9, C55, C6, C7, C9, E7, E9 size flat rubber is used.
(unit : mm)
003
SEPC
2700
2.5
(
Series
SEPC
B9 size has
no marking
Rated capacitance
)
φD
15min
L
19min
4min
Rated voltage
Recommended
soldering
condition
Technical data
Recommended
land pattern
dimension
Fundamental
structure
Ｃharacteristics
Reliability
TPU
TPH
TPG
TPSF
TPE
TPB/TPC
TPL TPLF
・
TPF
TA
TV
TH
TQC
Size list
μF
RV
100
150
180
220
C55
2.5
B9
4.0
6.3
RV : Rated voltage
10
16
C6，
C9
E7
E9, E12
E7
Size code
B9
C55
C6
C7
C9
E7
E9
φD
±0.5
5.0
6.3
6.3
6.3
6.3
8.0
8.0
8.0
8.0
10.0
L max
9.0
5.5
6.0
7.0
9.0
7.0
9.0
12.0
13.0
13.0
F
2.0
±0.5
2.5
±0.5
2.5
±0.5
2.5
±0.5
2.5
±0.5
3.5
±0.5
3.5
±0.5
3.5
±0.5
3.5
±0.5
5.0
±0.5
φd
±0.05
0.6
0.45
0.45
※3
0.6
0.6
※4
0.6
0.6
0.6
0.6
0.6
Surface mount type
270
330
390
470
560
680
820
1,000
1,500
2,700
F13
C9,E7, E9, E13
E9
F13
B9, C9
C6
B9
B9,
C6,
C9, E9 C9, E9, E13
E13
F13
C7,C9,
E9, E13
C9, E9
F13
E7
E9, E12
F13
E12
E13
F13
※3 2SEPC390M : 0.5
±0.05
※4 16SEPC150MD,10SEPC270MD : 0.45
±0.05
Catalog Deletion and
EOL models
54
RF/Wirelessly
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