Chip Monolithic Ceramic Capacitor for General
GRM188C80E476ME05_ (0603, X6S:EIA, 47uF, DC2.5V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GRM
18
(1)L/W
Dimensions
8
(2)T
Dimensions
C8
(3)Temperature
Characteristics
0E
(4)Rated
Voltage
476
(5)Nominal
Capacitance
M
(6)Capacitance
Tolerance
E05
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
1.6±0.2
(1)-2 W
0.8±0.2
(2) T
0.8±0.2
e
0.2 to 0.55
(Unit:mm)
g
0.6 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X6S(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-22 to 22 %
-55 to 105 °C
(25 °C)
DC 2.5 V
47 uF
±20 %
-55 to 105 °C
5.Package
mark
D
J
(8) Packaging
f180mm
Reel
PAPER W8P4
f330mm
Reel
PAPER W8P4
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Nov.10,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM188C80E476ME05-01
1
■
Specifications and Test Methods (Only for mobile devices)
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, V
P-P
or V
O-P
,
whichever is larger, should be maintained within the rated voltage
range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using calipers. (GRM02 size is based on Microscope)
Measurement Point
Test Voltage
Applied Time
5
Insulation Resistance(I.R.)
More than 2000MΩ or 50Ω ∙ F (Whichever is smaller)
Measurement Point
Measurement Voltage
Charging Time
:Between the terminations
: 1 to 5 s
: Between the terminations
: DC Rated Voltage
: 1 min
: 250% of the rated voltage
Charge/discharge current : 50mA max.
Charge/discharge current : 50mA max.
Measurement Temperature :Room Temperature
6
7
Capacitance
Dissipation Factor (D.F.)
Shown in Rated value.
B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.
D8,GRM31CR60J107 : 0.15 max
GRM31CR71E106 : 0.125 max
*Table 1
GRM033 B3/R6 1A 123 to 823
GRM033 B3/R6 1A 104
GRM155 B3/R6 1A 124 to 105
GRM185 B3/R6 1C/1A 105
GRM185 C8/D7 1A 105
GRM188 B3/R6 1C/1A 225
GRM188 R7/C8/D7 1A 225
GRM188 B3/R6 1A 335
GRM219 B3/R6 1C/1A 475
GRM219 C8 1A 475
GRM219 B3/R6 1A 106
GRM21B B3/R6 1C/1A 106
GRM21B R7/C8 1A 106
GRM319 B3/R6 1C/1A 106
Measurement Temperature :Room Temperature
Capacitance
*1 C≦10μF
(10V min.)
*2 C≦10μF
(6.3V max.)
C＞10μF
Frequency
1+/-0.1kHz
1+/-0.1kHz
120+/-24Hz
Voltage
1.0+/-0.2Vrms
0.5+/-0.1Vrms
0.5+/-0.1Vrms
*1 For items listed in Table 1 on the left, the capacitance should
be measured using a voltage of 0.5+/-0.1Vrms instead of
1.0+/-0.2Vrms.
*2 For item GRM188R70J105, the capacitance should be measured
using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.
6.Capacitance
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
The capacitance change should be measured after 5 min.
at each specified temp. stage.
In case of applying voltage, the capacitance change should be
measured after 1 min. with applying voltage in equilibration of
each temp. stage.
Capacitance value as a reference is the value in step 3.
· Measurement Voltage : 0.05+/-0.01Vrms
8
Temperature
Characteristics
of Capacitance
No bias
B1,B3 : Within +/-10%
R1,R7 : Within +/-15%
R6
C6
C7
C8
E7
D7
D8
: Within +/-15%
: Within +/-22%
: Within+/-22%
: Within +/-22%
: Within +22/-56%
: Within +22/-33%
: Within +22/-33%
(-25°C to +85°C)
(-55°C to +125°C)
(-55°C to +85°C)
(-55°C to +85°C)
(-55°C to +125°C)
(-55°C to +105°C)
(-55°C to +125°C)
(-55°C to +125°C)
(-55°C to +105°C)
50% of
the rated
voltage
B1: Within +10/-30%
R1: Within +15/-40%
Step
1
2
3
4
5
6
7
8
Temperature(C)
Reference Temp.+/-2
Min.Operating Temp. +/-3
Reference Temp. +/-2
Max.Operating Temp. +/-3
Reference Temp. +/-2
Min.Operating Temp. +/-3
Reference Temp. +/-2
Max.Operating Temp.+/-3
Applying Voltage(VDC)
No bias
50% of
the rated voltage
(For B1,R1)
½Initial
measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
GRM02
GRM03
GRM15/GRM18
GRM21/GRM31/GRM32
Solder the capacitor on the test substrate shown in Fig.3.
Type
Applied Force(N)
1
2
5
10
Holding Time
: 10+/-1s
capacitor side.
Applied Direction : In parallel with the test substrate and vertical with the
JEMCGS-04498B
2
No
10 Vibration
Item
Appearance
Capacitance
D.F.
Specification
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
Total amplitude
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
:1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Bending test
Appearance
Capacitance
Change
No defects or abnormalities.
Within +/-10%
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method
Flexure
Holding Time
Soldering Method
: Shown in Fig.2
:
1mm
:5+/-1s
: Reflow soldering
: Solder bath method
Solution of rosin ethanol 25(wt)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
2+/-0.5s
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
10+/-0.5s
: 24+/-2h
: GRM31 size max.: 120℃ to 150℃ for 1 min
GRM32 size : 100℃ to 120℃ for 1 min
and 170℃ to 200℃ for 1 min
· Initial measurement
12 Solderability
95% of the terminations is to be soldered evenly and
continuously.
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
:
<GRM03 size min.>
Test Method
Solder
Solder Temp.
Immersion time
:
Exposure Time
Preheat
13 Resistance
to
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
Within +/-15%
D.F.
Within the specified initial value.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
<GRM02 size only>
Test Method
: Reflow soldering (hot plate)
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: Glass epoxy PCB
: 24+/-2h
: 120℃ to 150℃ for 1 min
I.R.
Within the specified initial value.
Solder
Solder Temp.
Reflow Time
Test Substrate
Voltage proof No defects.
Exposure Time
Preheat
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14 Temperature
Sudden Change
Capacitance
Change
B1,R1,B3,R6,R7,C6,C7,C8,D7,D8
E7
: Within +/-7.5%
: Within +/-30%
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
Step
1
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp
Max.Operating Temp.+3/-0
Room Temp
Time
(min)
30+/-3
2 to 3
30+/-3
2 to 3
2
D.F.
Within the specified initial value.
3
4
I.R.
Within the specified initial value.
Exposure Time
· Initial measurement
: 24+/-2h
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
·
GRM188B30J106M Measurement after test:
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15
High
Temperature
High
Humidity
(Steady)
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
Capacitance
Change
D.F.
Within +/-12.5%
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.
More than 200MΩ or 5Ω ∙ F (Whichever is smaller)
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
JEMCGS-04498B
3
No
16 Durability
Item
Appearance
Specification
No defects or abnormalities.
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 150% of the rated voltage
Capacitance
Change
Within +/-12.5%
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
D.F.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.
More than 200MΩ or 5Ω ∙ F (Whichever is smaller)
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Useful Lifetime for mobile application specific MLCC
100
at rated voltage x 80%
These MLCC products are designed for use in devices w ith a typical lifetime of less than 5 years.
(Examples: Cellular phone, Smartphone, Tablet PC, Digital camera, Watch, Electronics dictionary,
Small-scale server, IPC-9592B class1 equipment, etc.)
These MLCC products are designed so that the useful lifetime can be extended longer than 5 years
under the follow ing conditions:
「80%
of the rated voltage or less, Maximum operating temperature -20 degree C or less
」
Usuful Lifetime [Year]
10
1
105℃ Type
Extended useful lifetime, under specific operating conditions, can be estimated from
the chart on the left.
85℃ Type
0.1
40
50
60
70
80
90 100 110 120 130
※The
useful lifetime is the time w hen cumulative failure rate becomes 1%.
※Please
note that the useful lifetime data is for reference only and not guaranteed.
Product Temperture [℃]
JEMCGS-04498B
4
Test method : Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Type
Land
1.75±0.1
3.5±0.05
b
f4.5
a
100
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
*1,2：2.0±0.05
0.56
0.9
+0.1
φ1.5
-0
1.5
3.0
4.0
Ａ
5.0
5.0
Ｂ
c
4.0±0.1
0.23
＊2
＊1
0.3
0.5
1.2
1.65
2.0
2.9
40
c
c
0.05以下
8.0±0.3
t
Fig.1
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Pressurization
method
(in mm)
20
50 min.
Pressurization
speed
1.0mm/s
acitor
R5
Pressurize
45
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・
Kind of Solder : Sn-3.0Ag-0.5Cu
・
Land Dimensions
Chip Capacitor
Land
Type
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
b
a
Solder Resist
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
0.56
0.9
1.5
3.0
4.0
5.0
5.0
c
0.23
0.3
0.5
1.2
1.65
2.0
2.9
c
Fig.3
JEMCGS-04498B
5
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