Precondition for Class II MLCC measurement: Apply a preheat treatment @150±10°C for 1 hour. The measurement
should be applied after 24±2 hrs the part was stored under ambient conditions. There is not any precondition necessary
for Class I MLCC.
C Schematic:
E General information:
General Purpose MLCC
Ceramic Type:
Temperature Coeffecient:
Storage Conditions:
Operating Temperature:
Dielectric Strength:
General Test conditions:
FIT according to
DESCRIPTION
X7R Class II
± 15% max.
35°C, <45% RH
-55 °C bis +125 °C
5 sec. @250% UR; Charge & Discharge Current < 50mA
25°C, 30-70% RH; if not specified differently
separate documentation
L ± 0.4
W ± 0.3
H ± 0.1
E ± 0.25
l
p
w
4.5
3.2
1.25
0.75
5.30
3.50
3.80
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WCAP-CSGP Ceramic Capacitors
Order.- No.
SIZE
A4
885012210004
Size: 1812
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
D2 Mechanical Properties:
Properties
Adhesive Strength of Termination
Definition
0402 & 0603
> 0603
Vibration Resistance
Resistance to Solder Heat
Solder Temperature
Dipping Time
Specific
10 ±1 sec; 5N
10 ±1 sec; 10N
all 3 directions, 2 hours each @ 10 - 55 - 10 Hz,
amplitude 0.75 mm or 10 g
260°C ±5°C
10 ±1 sec
Refer to Soldering Profile
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012210004
Size: 1812
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
H Soldering Specifications:
H1: Classification Reflow Profile for SMT components:
H2: Classification Reflow Profiles
Profile Feature
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (ts) from (Tsmin to Tsmax)
Ramp-up rate (TL to TP)
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak package body temperature (Tp)
Time within 5°C of actual peak temperature (tp)
Ramp-down rate (TP to TL)
Time 25°C to peak temperature
refer to IPC/JEDEC J-STD-020D
Pb-Free Assembly
150°C
200°C
60-120 seconds
3°C/ second max.
217°C
60-150 seconds
See Table H3
20-30 seconds
6°C/ second max.
8 minutes max.
H3: Package Classification Reflow Temperature
Package Thickness
PB-Free Assembly
PB-Free Assembly
PB-Free Assembly
refer to IPC/JEDEC J-STD-020D
< 1.6 mm
1.6 - 2.5 mm
≥ 2.5 mm
Volume mm³
<350
260°C
260°C
250°C
Volume mm³
350 - 2000
260°C
250°C
245°C
Volume mm³
>2000
260°C
245°C
245°C
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012210004
Size: 1812
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
I Cautions and Warnings:
The following conditions apply to all goods within the product series of WCAP-CSGP
of Würth Elektronik eiSos GmbH & Co. KG:
1. General
•The capacitor is engineered, designed and manufactured to be used within the datasheet specified values.
•Do not use the capacitor neither short term nor long term outside the specified values, which are given in the data sheet.
•Do not apply any kind of flexural or compressive force onto soldered or unsoldered component.
•Prevent the capacitor surface from any damage or scratches with sharp edges (e.g. chassis, screwdrivers, pincers)
2. Product specific
The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of
the customer. All technical specifications for standard products do also apply to customer specific products.
Follow all instructions mentioned in the data sheet, especially the following items:
2.1 Storage conditions
•These ceramic capacitors must be stored in stable conditions within an ambient temperature between 5°C to 40°C with a relative humi-
dity of <70%.
•The environment in which the capacitors are operated and stored has to have atmospheric characteristics and must be free of dew con-
densation and toxic gases (e.g. chlorine, ammonia, sulfur, hydrogen sulphide and hydrogen sulfate).
•All products shall be used before the end of the period of 12 months based on the product date code, if not, a 100% solderability cannot
be guaranteed.
•The capacitance tolerance as specified within the datasheet is only valid on the date of delivery.
2.2 Operating climatic conditions
•Do not exceed the lower nor the upper specified temperature under no condition.
•Be aware that the specified capacitance tolerance is only valid at the date delivery and according specified measurement criteria.
•Do not use the capacitors under high humidity, high temperature nor under high or low atmospheric pressure which may affect capacitors
reliability.
•Surface temperature including self-heating must be kept below the maximum operating temperature.
•The temperature rise of the capacitor´s temperature compared to ambient temperature shall be below 20°C.
•Avoid any water or heavy dust on capacitors surface, which may cause electrical leakage, damage, overheating or corrosion.
2.3 Operating load conditions
•Do not use the capacitor with any higher than specified voltage.
•Violation of the technical product specifications such as exceeding the specified voltage will void the warranty.
•Operating voltage across the terminals including AC and DC peaks and AC or pulse overshooting, Vp-p as well as irregular voltage becau-
se of resonance or switching must be below the rated voltage.
•Due to self-heating the reliability of the capacitor may be reduced, if high frequency AC or pulse is applied.
•Avoid any overload or conditions that are not specified in the capacitors datasheet.
•Consider carefully possible specific changes of electrical characteristics like capacitance over temperature, voltage and time as well as
the specific performance over frequency for the actual use conditions. For detailed information see datasheet.
2.4 Design of the P.C. board
•The chip capacitor shall be located to minimize any possible mechanical stress from deflection or board wrap.
•It is recommended to position the chip capacitor in parallel to slits and perforations and as far away from slits, perforations, separation
points, screw holes, frames and edges of the P.C. board to avoid mechanical stress.
•Determine the shape and size of the solder pads to have proper amount of solder on the terminations as the amount of solder at the ter-
minations has a direct effect on the reliability of the capacitor.
•Provide individual solder pads for each termination. Solder pads are specified in the datasheet.
•The PCB design (e.g. land pattern design and grounding planes) must be evaluated for each individual circuit to achieve the optimal sol-
dering results.
2.5 Mounting
•Avoid any stress from the mounting head to avoid cracks.
•Adjust the bottom dead center of the mounting head not to press on the P.C. board surface.
•The mounting head pressure has to be adjusted to 1 N up to 3 N of static force.
•Provide support from the bottom side of the P.C. board by a support pin for minimizing the impact energy from the mounting head.
•Provide sufficient close up dimension, preventive maintenance and replacement of the centering jaw to avoid a crack when it is worn out.
2.6 Adhesive
Selection of adhesive
•The adhesive should have sufficient coating and viscosity and should harden rapidly.
•The adhesive should be strong enough to hold parts on the board during the mounting and solder process and should have sufficient
strength at high temperatures.
•The adhesive should have corrosion resistance, excellent insulation characteristics and no emission of toxic gasses nor any effect on the
human body.
•Do not use too much adhesive to avoid pollution of the soldering pads.
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012210004
Size: 1812
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
I Cautions and Warnings (2):
The following conditions apply to all goods within the product series of WCAP-CSGP
of Würth Elektronik eiSos GmbH & Co. KG:
2.7 Soldering
•The detailed soldering instructions for reflow and wave soldering are given within Soldering Specification in the datasheet.
•The soldering profile has to be compliant with the technical soldering specification, otherwise this will void the warranty.
•Avoid any other than specified temperature and / or time conditions during soldering.
•Customer needs to ensure that the applied solder paste, the paste thickness and solder conditions are applicable to guarantee a sufficient
solder result according to the relevant criteria of IPC-A-610.
•Excessive amount of solder may lead to higher tensile force and chip cracking. Insufficient amount of solder may detach the capacitor due
to defective contacts.
•Do not use excessive nor insufficient flux.
•Provide enough washing when water-soluble flux is used.
•Consider the preheating conditions as follows to avoid thermal shock:
Soldering
Wave soldering
Reflow soldering
Reflow soldering
Manual soldering
Manual soldering
Size
0603, 0805
1206 or less
1210 or more
1206 or less
1210 or more
Temperature difference (ΔT)
ΔT ≤ 150°C
ΔT ≤ 190°C
ΔT ≤ 130°C
ΔT ≤ 190°C
ΔT ≤ 130°C
2.8 Cleaning
•Cleaning agents that are used to clean the customer application might damage or change the characteristics of the component, body,
pins or termination.
•Avoid Halogen in the flux or any contaminated flux as well as excessively high ultrasonic cleaning.
2.9 Coating, molding and potting of the P.C. board
•When coating and molding the P.C. board verify the quality influence on the capacitor.
•Verify the curing temperature and assure that there is no harmful decomposing or reaction gas emission during curing.
•Do not exceed the maximal temperature rise of 20°C.
•If the product is potted in customer applications, the potting material might shrink during and after hardening. The product is exposed to
the pressure of the potting material with the effect that the body and termination is possibly damaged and so the electrical as well as the
mechanical characteristics are endangered to be affected. After the potting material is cured, the body and termination of the product ha-
ve to be checked if any reduced electrical or mechanical functions or destructions have occurred.
2.10 Handling after chip is mounted
•Direct mechanical impact to the product shall be prevented.
•After soldering please pay attention not to bend, twist or distort the P.C. board in handling and storage.
•Avoid excessive pressure during the functional check of the P.C. board.
•Avoid bending stress while breaking the P.C. board.
2.11 Handling of loose chip capacitor
•Once dropped do not use the chip capacitor.
•After mounting avoid piling up P.C. boards to avoid hitting the chip capacitor of another board.
•It is recommended to use air for natural cooling. When dipping the chips into a solvent for cleaning, the temperature difference (∆T) must
be less than 100°C.
•For reflow soldering two times limitation is recommended.
•Wave soldering is recommended only for the following case sizes: 0603 and 0805, thickness< 1mm.
•Please ensure for manual soldering (solder iron) not to exceed the general temperature capabilities as specified above.
•The following conditions are recommended for solder repair by solder iron:
Size
Temp. (°C)
Preheating Temp. (°C) Temperature difference (ΔT) Atmosphere
1206 or less 330 ± 20°C >150°C
ΔT ≤ 190°C
Room air
1210 or more 280°C max
>150°C
ΔT ≤ 130°C
Room air
•Typical time of actual peak temperature: <5 sec (300°C), <3 sec (350°C); as short as possible
•Do not make direct contact with the ceramic dielectric.
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012210004
Size: 1812
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
[size=5][color=#ff0000][b]Good resource classification can help everyone find the required resources faster and more accurately! [/b][/color][/size] [size=4] Recently, I have been studying the resourc...
I use the lm3s9b92 demo board and burn the usb_dev_bulk example. After connecting it to the computer, it prompts me to install the driver? Where can I find this driver? What software can I use on the ...
I have another stupid question - is the file burned into the chip a hex file? Thank you thank you thank you to everyone who answered my question! I am so grateful!...
1. Several nouns
ABI:
The specifications that an executable file must follow in order to run in a specific execution environment;
Separately generated relocatabl...[Details]
Whether it is an electric car or an ordinary fuel car, for the vast majority of car buyers, the final cost of use is what they care about most. For fuel cars, how to save fuel is what drivers care ...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
As AI accelerates across industries, the demand for data center infrastructure is also growing rapidly.
Keysight Technologies, in collaboration with Heavy Reading, released the "Beyo...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
To improve the lateral active safety of intelligent connected vehicles, the identification and definition of unexpected functional safety scenarios for the EPS (Electronic Steering System) ...[Details]
A pure sine wave inverter has a good output waveform with very low distortion, and its output waveform is essentially the same as the AC waveform of the mains power grid. In fact, the AC power prov...[Details]
Plug-in hybrid vehicles (PHEVs) utilize two powertrains. Their pure electric range is typically inferior to that of pure electric vehicles, often reaching less than half that. Currently, mainstream...[Details]
With the gradual popularization of new energy vehicles in recent years, more and more people have been able to access and purchase electric vehicles. The structure of electric vehicles is composed ...[Details]
Renesas Electronics' new ultra-low-power RA4C1 MCU features advanced security and a dedicated peripheral set, making it ideal for metering and other applications.
The new product mee...[Details]
Introduction: In digital circuit calculations, there is no concept of decimal points. You know where the decimal is, but the circuit does not know where the decimal point is. Therefore, you need to...[Details]
The Waveshare ESP32-P4-ETH is a compact ESP32-P4 development board with Ethernet and PoE support. It looks very similar to the Olimex ESP32-P4-DevKit, minus the pUEXT connector. However, we've also...[Details]
This new standardized, pre-integrated computing platform is designed to accelerate chip development, reduce development costs, and provide scalable software to power the AI-defined car.
...[Details]
Talking
京公网安备 11010802033920号
EEWORLD
