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IDT77211L155PQF9

Description
ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208
CategoryWireless rf/communication    Telecom circuit   
File Size297KB,27 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT77211L155PQF9 Overview

ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208

IDT77211L155PQF9 Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionFQFP,
Contacts208
Reach Compliance Codeunknow
JESD-30 codeS-PQFP-G208
JESD-609 codee0
length28 mm
Number of functions1
Number of terminals208
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Package shapeSQUARE
Package formFLATPACK, FINE PITCH
Certification statusNot Qualified
Maximum seat height3.45 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width28 mm
Base Number Matches1
155 Mbps ATM SAR
CONTROLLER FOR
PCI-BASED NETWORKING
APPLICATIONS
x
IDT77211
Key .eatures
Full-duplex Segmentation and Reassembly (SAR) at
155 Mbps "wire-speed" (310 Mbps aggregate speed).
Performs ATM layer protocol functions.
Supports AAL5, AAL3/4, "AAL0" and "Raw Cell" formats.
Supports Constant Bit Rate (CBR)Variable Bit Rate (VBR)
and Unassigned Bit Rate (UBR) service classes.
Reassembles received CS-PDUs directly into host memory.
Two buffer pools for independant or chained reassembly
Segments CS-PDUs ready for transmission directly from
host memory.
PCI bus master interface for efficient, low latency DMA
transfers with host system.
Operates with ATM networks up to 155.52 Mbps.
Up to 16K open transmit connections.
Up to 16K simultaneous receive connections.
Glue-less integration to host system's PCI bus.
UTOPIA Interface to PHY.
Utility & Management Interface to PHY.
Standalone controller: embedded processor not required.
Supports high-performance, lowest-cost ATM NIC solution.
Supports Big/Little endian on PCI interface
Descriptions
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The IDT77211 NICStAR
is a member of IDT's family of products for
Asynchronous Transfer Mode (ATM) networks. The NICStAR performs
both the ATM Adaption Layer (AAL) Segmentation and Reassembly
(SAR) function and the ATM layer protocol functions.
A Network Interface Card (NIC) or internetworking product based on
the NICStAR uses host memory, rather than local memory, to reassemble
Convergence Sublayer Protocol Data Units (CS-PDUs) from ATM cell
payloads received from the network. When transmitting, as CS-PDUs
become ready, they are queued in host memory and segmented by the
NICStAR into ATM cell payloads. From this, the NICStAR then creates
complete 53-byte ATM cells which are sent through the network. The
NICStAR's on-chip PCI bus master interface provides efficient, low latency
DMA transfers with the host system, while it's UTOPIA interface provides
direct connection to PHY components used in 25.6 Mbps to 155 Mbps ATM
networks.
The IDT77211 is fabricated using state-of-the-art CMOS technology,
providing the highest levels of integration, performance and reliability, with
the low-power consumption characteristics of CMOS.
System-Level .unctional Block Diagram
32K x32
SRAM
PCI BUS
PROM
32
8
Rx UTOPIA Bus
PCI Interface
8
33MHZ
32
IDT77211
155Mbps
PCI ATM
SAR
155Mbps
PHY
2
2
Tx UTOPIA Bus
8
Utility Bus
8
4
50.0MHZ OSC.
EEPROM
3502 drw 01
MARCH 2001
1
©2001 Integrated Device Technology, Inc.
DSC-3502/6

IDT77211L155PQF9 Related Products

IDT77211L155PQF9 IDT77211L155PQF8
Description ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208
Parts packaging code QFP QFP
package instruction FQFP, FQFP,
Contacts 208 208
Reach Compliance Code unknow unknow
JESD-30 code S-PQFP-G208 S-PQFP-G208
JESD-609 code e0 e0
length 28 mm 28 mm
Number of functions 1 1
Number of terminals 208 208
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FQFP FQFP
Package shape SQUARE SQUARE
Package form FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Certification status Not Qualified Not Qualified
Maximum seat height 3.45 mm 3.45 mm
Nominal supply voltage 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature level COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
width 28 mm 28 mm
Base Number Matches 1 1

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