5962-8954303PB datasheet, PDF - EEWORLD Datasheet

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5962-8954303PB: Description5962-8954303PB amplifier basic information: 5962-8954303PB is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are CERAMIC, DIP-8 5962-8954303PB amplifier core information: The minimum operating temperature of the 5962-8954303PB is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.0002 µA How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of 5962-8954303PB is 9 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the gain of 5962-8954303PB becomes 0.707 times the low-frequency gain is 3000 kHz. The nominal supply voltage of 5962-8954303PB is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of 5962-8954303PB is 4500 µV (Input offset voltage: the compensation voltage between the two input terminals required to make the output terminal of the operational amplifier 0V (or close to 0V).) The width of 5962-8954303PB is: 7.62 mm . Related dimensions of 5962-8954303PB: 5962-8954303PB has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. 5962-8954303PB amplifier additional information: Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-GDIP-T8. The corresponding JESD-609 code is: e0. The packaging code of 5962-8954303PB is: DIP. 5962-8954303PB packaging materials are mostly CERAMIC, GLASS-SEALED. The package shape is RECTANGULAR. The 5962-8954303PB package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.; CategoryAnalog mixed-signal IC Amplifier circuit; File Size79KB，14 Pages; ManufacturerPrecision Monolithics Inc; Alternative parts：5962-8954303PB

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5962-8954303PB Overview

5962-8954303PB amplifier basic information:

5962-8954303PB is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are CERAMIC, DIP-8

5962-8954303PB amplifier core information:

The minimum operating temperature of the 5962-8954303PB is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.0002 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of 5962-8954303PB is 9 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the gain of 5962-8954303PB becomes 0.707 times the low-frequency gain is 3000 kHz.

The nominal supply voltage of 5962-8954303PB is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of 5962-8954303PB is 4500 µV (Input offset voltage: the compensation voltage between the two input terminals required to make the output terminal of the operational amplifier 0V (or close to 0V).) The width of 5962-8954303PB is: 7.62 mm .

Related dimensions of 5962-8954303PB:

5962-8954303PB has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm.

5962-8954303PB amplifier additional information:

Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-GDIP-T8. The corresponding JESD-609 code is: e0. The packaging code of 5962-8954303PB is: DIP. 5962-8954303PB packaging materials are mostly CERAMIC, GLASS-SEALED.

The package shape is RECTANGULAR. The 5962-8954303PB package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

5962-8954303PB Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, DIP-8
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.0002 µA
Nominal Common Mode Rejection Ratio	80 dB
Maximum input offset voltage	4500 µV
JESD-30 code	R-GDIP-T8
JESD-609 code	e0
Negative supply voltage upper limit	-22 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Nominal slew rate	9 V/us
Supply voltage upper limit	22 V
Nominal supply voltage (Vsup)	15 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	3000 kHz
width	7.62 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Add device type 04 for device class V and radiation hardened requirements.

Delete CAGE 64155. –ro

Drawing updated to reflect current requirements. -rrp

DATE (YR-MO-DA)

00-03-16

APPROVED

R. MONNIN

05-01-20

R. MONNIN

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

RICK OFFICER

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

CHARLES E. BESORE

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

MICHAEL A. FRYE

MICROCIRCUIT, LINEAR, JFET-INPUT,

OPERATIONAL AMPLIFIER, MONOLITHIC

SILICON

DRAWING APPROVAL DATE

89-10-25

AMSC N/A

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-89543

DSCC FORM 2233

APR 97

5962-E268-04

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

MACY1-X8

GDIP1-T8 or CDIP2-T8

Terminals

Package style

Can

Dual-in-line

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/

Supply voltage range (V

Devices 01, 02, and 04:

Positive supply voltage (V+) ......................................................................

Negative supply voltage (V-) .....................................................................

Device 03:

Positive supply voltage (V+) ......................................................................

Negative supply voltage (V-) .....................................................................

Differential input voltage:

Devices 01, 02, and 04 .................................................................................

Device 03......................................................................................................

Input voltage:

Devices 01, 02, and 04 .................................................................................

Device 03......................................................................................................

Maximum power dissipation (P

) .....................................................................

Output short circuit duration .............................................................................

Storage temperature range ..............................................................................

Lead temperature (soldering, 60 seconds).......................................................

Junction temperature (T

) ................................................................................

+22 V dc

-22 V dc

+18 V dc

-18 V dc

±40

V dc

±30

V dc

±20

V dc

±16

V dc

500 mW 2/

Indefinite

-65°C to +150°C

+300°C

+150°C

Thermal resistance, junction-to-case (θ

) ...................................................... See MIL-STD-1835

Thermal resistance, junction-to-ambient (θ

Case G ......................................................................................................... 150°C/W

Case P.......................................................................................................... 119°C/W

1.4 Recommended operating conditions.

Supply voltage (V

)..........................................................................................

±15

Ambient operating temperature (T

) ................................................................ -55°C to +125°C

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ............................ 100 Krads 3/

Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

Derate linearly 6.7 mW/°C above T

= +75°C for P package; Derate linearly 7.1 mW/°C above T

= +80°C for G package.

These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.

Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,

method 1019, condition A.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89543

SHEET

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89543

SHEET

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