CYStech Electronics Corp.
100V/100mA SURFACE MOUNT SWITCHING DIODE
Spec. No. : C332SG
Issued Date : 2004.03.26
Revised Date :
Page No. : 1/3
CASD355SG
Features:
●
Small surface mounting type
●
High reliability
●
High speed(trr<4ns)
Mechanical data:
●
Case: Molded plastic, JEDEC SOD-323
●
Terminals : Solder plated, solderable per MIL-STD-750, method 2026.
●
Polarity: Indicated by cathode band
●
Mounting position: Any
●
Weight: 0.000159 ounce, 0.0045 gram
Absolute Maximum Ratings
(At Ta=25℃, unless otherwise noted)
Characteristics
Repetitive Peak Reverse Voltage
Average Forward Current, V
R
=0
Peak Forward Surge Current, tp<1s
Power Dissipation
Junction Temperature
Storage Temperature Range
Symbol
V
RRM
I
FAV
I
FSM
P
D
Tj
Tstg
Value
100
100
500
350
175
-55 to +175
Unit
V
mA
mA
mW
°C
°C
Electrical Characteristics
( At Ta=25°C, unless otherwise noted)
Parameter
Forward Voltage
Reverse Current
Breakdown Voltage
Diode Capacitance
Reverse Recovery Time
Conditions
I
F
=10mA
V
R
=25V
V
R
=25V, Tj=150℃
V
R
=80V
I
R
=100µA, Tp/T=0.01, Tp=0.3ms
V
R
=0, f=1MHz, V
HF
=50mV
I
F
=10mA,V
R
=6V,I
RR
=0.1×I
R
, R
L
=100Ω
Symbol
V
F
I
R
I
R
I
R
V
(BR)
C
D
t
rr
Min
-
-
-
-
100
Typ
-
-
-
-
-
Max
1.2
100
50
30
-
4
4
Unit
V
nA
µA
µA
V
pF
ns
CASD355SG
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Reverse Leakage Current vs Junction Temperature
1000
Reverse Leakage Current---I
R
(μA)
V
R
=80V / Max. Values
Spec. No. : C332SG
Issued Date : 2004.03.26
Revised Date :
Page No. : 2/3
Forward Current vs Forward Voltage
1000
Instantaneous Forward Current---I
F
(mA)
Tj=25℃
Pulse Width 300μs
1% Duty Cycle
100
100
10
1
V
R
=80V / Typ Values
10
Scattering Limit
0.1
V
R
=25V / Typ. Values
1
0.01
0
20
40
60
80 100 120 140 160 180 200
Junction Temperature---T
j
(℃)
0.1
0
0.4
0.8
1.2
1.6
2
Forward Voltage---V
F
(V)
Reverse Leakage Current vs Reverse Voltage
1000
3
Tj= 25℃
100
Scattering Limit
10
Capacitance vs Reverse Voltage
Reverse Leakage Current---I
R(nA)
Diode Capacitance ---C
D
(pF)
2.5
f=1MHz
Ta=25℃
2
1.5
1
1
1
10
100
0.5
0.1
1
10
100
Reverse Voltage---V
R(V)
Reverse Voltage---V
R
(V)
CASD355SG
CYStek Product Specification
CYStech Electronics Corp.
SOD-323F Dimension
Spec. No. : C332SG
Issued Date : 2004.03.26
Revised Date :
Page No. : 3/3
SOD-323F Plastic Surface
Mounted Package
CYStek Package Code:SG
*:Typical
DIM
A
B
C
Inches
Min.
Max.
0.090
0.106
0.045
0.053
0.012(typ)
Millimeters
Min.
Max.
2.3
2.7
1.15
1.35
0.3(typ)
DIM
D
R
Inches
Min.
Max.
0.028
0.035
0.02(typ)
Millimeters
Min.
Max.
0.7
0.9
0.5(typ)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CASD355SG
CYStek Product Specification
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