ML610Q438P-NNNTC03A7 datasheet, PDF

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ML610Q438P-NNNTC03A7: Description8-bit Microcontrollers - MCU Low Power MCU; LCD 24x56, 128Kbyte ROM, LQFP144; Categorysemiconductor The embedded processor and controller; File Size5MB，473 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/

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8-bit Microcontrollers - MCU Low Power MCU; LCD 24x56, 128Kbyte ROM, LQFP144

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FEUL610Q438-03

ML610Q438/ML610Q439

User’s Manual

Issue Date: May. 08, 2015

ML610Q438/ML610Q439 User’s Manual

Notes

1) The information contained herein is subject to change without notice.

2) Although LAPIS Semiconductor is continuously working to improve product reliability and quality, semiconductors

can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising

from failure, please take safety measures such as complying with the derating characteristics, implementing

redundant and fire prevention designs, and utilizing backups and fail-safe procedures. LAPIS Semiconductor shall

have no responsibility for any damages arising out of the use of our Products beyond the rating specified by LAPIS

Semiconductor.

3) Examples of application circuits, circuit constants and any other information contained herein are provided only to

illustrate the standard usage and operations of the Products.The peripheral conditions must be taken into account

when designing circuits for mass production.

4) The technical information specified herein is intended only to show the typical functions of the Products and

examples of application circuits for the Products. No license, expressly or implied, is granted hereby under any

intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the

information contained in this document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for

any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.

5) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer

systems, gaming/entertainment sets) as well as the applications indicated in this document.

6) The Products specified in this document are not designed to be radiation tolerant.

7) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact

and consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains), primary

communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar

cells, and power transmission systems.

8) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear

power control systems, and submarine repeaters.

9) LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non-compliance with the

recommended usage conditions and specifications contained herein.

10) LAPIS Semiconductor has used reasonable care to ensure the accuracy of the information contained in this

document. However, LAPIS Semiconductor does not warrant that such information is error-free and LAPIS

Semiconductor shall have no responsibility for any damages arising from any inaccuracy or misprint of such

information.

11) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS

Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS

Semiconductor shall have no responsibility for any damages or losses resulting non-compliance with any applicable

laws or regulations.

12) When providing our Products and technologies contained in this document to other countries, you must abide by

the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation

the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.

13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS

Semiconductor.

2010 – 2015 LAPIS Semiconductor Co., Ltd.

2-4-8 Shinyokohama, Kouhoku-ku,

Yokohama 222-8575, Japan

http://www.lapis-semi.com/en/

FEUL610Q438

ML610Q438/ML610Q439 User’s Manual

Contents

Table of Contents

Chapter 1

1. Overview......................................................................................................................................................... 1-1

1.1 Features ....................................................................................................................................................... 1-1

1.2 Configuration of Functional Blocks ............................................................................................................ 1-5

1.2.1

Block Diagram of ML610Q438 .......................................................................................................... 1-5

1.2.2

Block Diagram of ML610Q439 .......................................................................................................... 1-6

1.3 Pins ............................................................................................................................................................. 1-7

1.3.1

Pin Layout ........................................................................................................................................... 1-7

1.3.1.1 Pin Layout of ML610Q438 LQFP Package..................................................................................... 1-7

1.3.1.2 Pin Layout of ML610Q439P LQFP Package .................................................................................. 1-8

1.3.1.3 Pin Layout of ML610Q438 Chip ..................................................................................................... 1-9

1.3.1.4 Pin Layout of ML610Q439 Chip ................................................................................................... 1-10

1.3.1.5 Pad Coordinates of ML610Q438 Chip .......................................................................................... 1-11

1.3.1.6 Pad Coordinates of ML610Q439 Chip .......................................................................................... 1-12

1.3.2

List of Pins ........................................................................................................................................ 1-13

1.3.3

Description of Pins ............................................................................................................................ 1-17

1.3.4

Termination of Unused Pins ............................................................................................................. 1-21

1.3.5

The main difference points of ML610Q438 and ML610Q439 ......................................................... 1-21

Chapter 2

2. CPU and Memory Space ................................................................................................................................. 2-1

2.1 Overview..................................................................................................................................................... 2-1

2.2 Program Memory Space ............................................................................................................................. 2-1

2.3 Data Memory Space.................................................................................................................................... 2-2

2.4 Instruction Length ....................................................................................................................................... 2-2

2.5 Data Type.................................................................................................................................................... 2-2

2.6 Description of Registers .............................................................................................................................. 2-3

2.6.1

List of Registers .................................................................................................................................. 2-3

2.6.2

Data Segment Register (DSR) ............................................................................................................ 2-4

Chapter 3

3. Reset Function ................................................................................................................................................ 3-1

3.1 Overview..................................................................................................................................................... 3-1

3.1.1

Features ............................................................................................................................................... 3-1

3.1.2

Configuration ...................................................................................................................................... 3-1

3.1.3

List of Pin............................................................................................................................................ 3-1

3.2 Description of Registers .............................................................................................................................. 3-2

3.2.1

List of Registers .................................................................................................................................. 3-2

3.2.2

Reset Status Register (RSTAT) .......................................................................................................... 3-2

3.3 Description of Operation............................................................................................................................. 3-3

3.3.1

Operation of System Reset Mode ....................................................................................................... 3-3

Chapter 4

4. MCU Control Function ................................................................................................................................... 4-1

4.1 Overview..................................................................................................................................................... 4-1

4.1.1

Features ............................................................................................................................................... 4-1

4.1.2

Configuration ...................................................................................................................................... 4-1

4.2 Description of Registers .............................................................................................................................. 4-2

4.2.1

List of Registers .................................................................................................................................. 4-2

4.2.2

Stop Code Acceptor (STPACP) .......................................................................................................... 4-3

4.2.3

Standby Control Register (SBYCON) ................................................................................................ 4-4

4.2.4

Block Control Register 0 (BLKCON0)............................................................................................... 4-5

4.2.5

Block Control Register 1 (BLKCON1)............................................................................................... 4-6

FEUL610Q438

Contents-1

ML610Q438P-NNNTC03A7 Related Products

	ML610Q438P-NNNTC03A7	ML610Q438 REFBOARD	ML610Q439 REFBOARD	ML610Q438-NNNTCZ03A7	ML610Q439-NNNTCZ03A7	ML610Q439P-NNNTC03A7
Description	8-bit Microcontrollers - MCU Low Power MCU; LCD 24x56, 128Kbyte ROM, LQFP144	board ref ml610q438/ml610q438P	board ref ml610q439/ml610q439P	IC mcu 8bit 128kb flash 144lqfp	IC mcu 8bit 128kb flash 144lqfp	8-bit Microcontrollers - MCU Low Power MCU; LCD 16x64, 128Kbyte ROM, LQFP144

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