ZSSC3036CC1D datasheet, PDF - EEWORLD Datasheet

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ZSSC3036CC1D: DescriptionSensor Interface Die in waffle (tested to 0-+70C); Categorysemiconductor Analog mixed-signal IC; File Size1MB，49 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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Sensor Interface Die in waffle (tested to 0-+70C)

ZSSC3036CC1D Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	IDT (Integrated Device Technology, Inc.)
Product Category	Sensor Interface
Package / Case	DIE

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Data Sheet

Rev. 2.01 / August 2014

ZSSC3036

Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

Mobile Sensing ICs

Smart and Mobile

ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

Table of Contents

IC Characteristics .......................................................................................................................................... 7

1.1.

1.2.

1.3.

1.4.

2.1.

2.2.

2.3.

Absolute Maximum Ratings .................................................................................................................... 7

Operating Conditions .............................................................................................................................. 7

Electrical Parameters ............................................................................................................................. 8

Power Supply Rejection Ratio (RSRR) vs. Frequency......................................................................... 10

Brief Description ................................................................................................................................... 11

Signal Flow and Block Diagram............................................................................................................ 11

Analog Front End .................................................................................................................................. 12

Amplifier ......................................................................................................................................... 12

Analog-to-Digital Converter ............................................................................................................ 14

Temperature Measurement ........................................................................................................... 18

Bridge Supply ................................................................................................................................. 18

Digital Signal Processor (DSP) Core ............................................................................................. 18

MTP Memory.................................................................................................................................. 18

Clock Generator ............................................................................................................................. 19

Power Supervision ......................................................................................................................... 19

Interface ......................................................................................................................................... 19

Circuit Description ....................................................................................................................................... 11

2.3.1.

2.3.2.

2.3.3.

2.3.4.

2.4.

2.4.1.

2.4.2.

2.4.3.

2.4.4.

2.4.5.

3.1.

3.2.

3.3.

3.4.

3.5.

Digital Section ....................................................................................................................................... 18

Functional Description ................................................................................................................................. 20

Power Up .............................................................................................................................................. 20

Measurements ...................................................................................................................................... 20

Operational Modes ............................................................................................................................... 21

Command Interpretation ....................................................................................................................... 23

SPI/I C™ Commands .................................................................................................................... 23

Common Functionality ................................................................................................................... 26

SPI ................................................................................................................................................. 27

I C™ ............................................................................................................................................... 30

Programming Memory ................................................................................................................... 31

Memory Status Commands ........................................................................................................... 32

Memory Contents ........................................................................................................................... 33

3.4.1.

3.5.1.

3.5.2.

3.5.3.

3.6.

3.6.1.

3.6.2.

3.6.3.

Communication Interface ...................................................................................................................... 26

Memory ................................................................................................................................................. 31

Data Sheet

August 24, 2014

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

4 of 49

ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

3.7.

Calibration Sequence ........................................................................................................................... 39

Calibration Step 1 – Assigning Unique Identification ..................................................................... 40

Calibration Step 2 – Data Collection .............................................................................................. 40

Calibration Step 3 – Coefficient Calculations ................................................................................. 41

Bridge Signal Compensation ......................................................................................................... 41

Temperature Signal Compensation ............................................................................................... 44

3.7.1.

3.7.2.

3.7.3.

3.8.

3.8.1.

3.8.2.

The Calibration Math ............................................................................................................................ 41

Die Pad Assignments .................................................................................................................................. 45

Quality and Reliability .................................................................................................................................. 46

Ordering Sales Codes ................................................................................................................................. 46

Related Documents ..................................................................................................................................... 47

Glossary ...................................................................................................................................................... 47

Document Revision History ......................................................................................................................... 49

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

ZSSC3036 Functional Block Diagram ........................................................................................... 11

ADC Offset ..................................................................................................................................... 17

Operational Flow Chart: Power Up ................................................................................................ 22

Operational Flow Chart: Command Mode and Normal Mode ....................................................... 23

SPI Configuration CPHA=0 ........................................................................................................... 27

SPI Configuration CPHA=1 ........................................................................................................... 28

SPI Command Request ................................................................................................................. 28

SPI Read Status ............................................................................................................................ 29

SPI Read Data ............................................................................................................................... 29

C™ Command Request .............................................................................................................. 30

I C™ Read Status .......................................................................................................................... 30

Figure 3.10 I C™ Read Data ............................................................................................................................ 31

Figure 3.11 Memory Program Operation .......................................................................................................... 32

Figure 4.1

ZSSC3036 Pad Assignments ........................................................................................................ 45

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Data Sheet

August 24, 2014

Maximum Ratings ............................................................................................................................ 7

Operating Conditions ....................................................................................................................... 7

Requirements for VDD Power-on Reset .......................................................................................... 8

Electrical Parameters ....................................................................................................................... 8

Amplifier Gain: Stage 1 .................................................................................................................. 12

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

5 of 49

ZSSC3036CC1D Related Products

	ZSSC3036CC1D	ZSSC3036Cl6BH	ZSSC3036Cl1D	ZSSC3036Cl1CH
Description	Sensor Interface Die in waffle (tested to 0-+70C)	Sensor Interface Die on wafer 725 m(tested to 110C)	Sensor Interface Die in waffle pack(tested to-40-+85C)	Sensor Interface Die on frame (tested to110C)
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value
Manufacturer	IDT (Integrated Device Technology, Inc.)	IDT (Integrated Device Technology, Inc.)	IDT (Integrated Device Technology, Inc.)	IDT (Integrated Device Technology, Inc.)
Product Category	Sensor Interface	Sensor Interface	Sensor Interface	Sensor Interface
Package / Case	DIE	DIE	DIE	DIE

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