Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MC9S08AC128
Rev. 4, 8/2011
MC9S08AC128 8-Bit
Microcontroller Data Sheet
MC9S08AC128
917A-03
840B-01
824D-02
8-Bit HCS08 Central Processor Unit (CPU)
•
40-MHz HCS08 CPU (central processor unit)
•
20-MHz internal bus frequency
•
HC08 instruction set with added BGND, CALL and
RTC instructions
•
Memory Management Unit to support paged
memory.
•
Linear Address Pointer to allow direct page data
accesses of the entire memory map
Development Support
•
Background debugging system
•
Breakpoint capability to allow single breakpoint
setting during in-circuit debugging (plus two more
breakpoints in on-chip debug module)
•
On-chip in-circuit emulator (ICE) Debug module
containing three comparators and nine trigger
modes. Eight deep FIFO for storing change-of-flow
addresses and event-only data. Supports both tag
and force breakpoints.
Memory Options
•
Up to 128K FLASH — read/program/erase over full
operating voltage and temperature
•
Up to 8K Random-access memory (RAM)
•
Security circuitry to prevent unauthorized access to
RAM and FLASH contents
Clock Source Options
•
Clock source options include crystal, resonator,
external clock, or internally generated clock with
precision NVM trimming using ICG module
System Protection
•
Optional computer operating properly (COP) reset
with option to run from independent internal clock
source or bus clock
•
CRC module to support fast cyclic redundancy
checks on system memory
•
Low-voltage detection with reset or interrupt
•
Illegal opcode detection with reset
•
Master reset pin and power-on reset (POR)
Power-Saving Modes
•
Wait plus two stops
Peripherals
•
ADC
— 16-channel, 10-bit resolution, 2.5
s
conversion time, automatic compare function,
temperature sensor, internal bandgap reference
channel
•
SCIx
— Two serial communications interface
modules supporting LIN 2.0 Protocol and SAE J2602
protocols; Full duplex non-return to zero (NRZ);
Master extended break generation; Slave extended
break detection; Wakeup on active edge
•
SPIx
— One full and one master-only serial
peripheral interface modules; Full-duplex or
single-wire bidirectional; Double-buffered transmit
and receive; Master or Slave mode; MSB-first or
LSB-first shifting
•
IIC
— Inter-integrated circuit bus module; Up to 100
kbps with maximum bus loading; Multi-master
operation; Programmable slave address; Interrupt
driven byte-by-byte data transfer; supports broadcast
mode and 10 bit addressing
•
TPMx
— One 2-channel and two 6-channel 16-bit
timer/pulse-width modulator (TPM) modules:
Selectable input capture, output compare, and
edge-aligned PWM capability on each channel. Each
timer module may be configured for buffered,
centered PWM (CPWM) on all channels
•
KBI
— 8-pin keyboard interrupt module
Input/Output
•
Up to 70 general-purpose input/output pins
•
Software selectable pullups on input port pins
•
Software selectable drive strength and slew rate
control on ports when used as outputs
Package Options
•
80-pin low-profile quad flat package (LQFP)
•
64-pin quad flat package (QFP)
•
48-pin quad flat no-lead package (QFN)
•
44-pin low-profile quad flat package (LQFP)
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2007-2011. All rights reserved.
Table of Contents
Chapter 1
Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Chapter 2
Pins and Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2.1 Device Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . .5
Chapter 3
Electrical Characteristics and Timing Specifications . . . . . . .11
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.2 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .11
3.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .11
3.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .13
3.5 ESD Protection and Latch-Up Immunity . . . . . . . . . . . .14
3.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
3.7 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .18
3.8 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .21
3.9
3.10
Internal Clock Generation Module Characteristics . . .
3.9.1 ICG Frequency Specifications . . . . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.2 Timer/PWM (TPM) Module Timing. . . . . . . . . .
SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Specifications . . . . . . . . . . . . . . . . . . . . . . . . .
EMC Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . .
24
25
27
27
28
30
33
34
34
35
35
35
35
37
3.11
3.12
3.13
Chapter 4
Ordering Information and Mechanical Drawings . . . . . . . . . .
4.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 Orderable Part Numbering System . . . . . . . . . . . . . . .
4.3 Mechanical Drawings. . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 5
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Related Documentation
MC9S08AC128 Series Reference Manual (MC9S08AC128RM)
contains extensive product information including modes of operartion, memory, resets and interrupts, reg-
ister definitions, port pins, CPU, and all peripheral module information.
For the latest version of the documentation, check our website at:
http://www.freescale.com
MC9S08AC128 MCU Series Data Sheet, Rev. 4
2
Freescale Semiconductor
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