MB9BF428TABGL-GE1 datasheet, PDF

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MB9BF428TABGL-GE1: DescriptionARM Microcontrollers - MCU MM MCU; Categorysemiconductor The embedded processor and controller; File Size2MB，134 Pages; ManufacturerCypress Semiconductor

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ARM Microcontrollers - MCU MM MCU

MB9BF428TABGL-GE1 Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Cypress Semiconductor
Product Category	ARM Microcontrollers - MCU
RoHS	Details
Mounting Style	SMD/SMT
Package / Case	FBGA-192
Core	ARM Cortex M3
Data Bus Width	32 bit
Maximum Clock Frequency	60 MHz
Program Memory Size	1 MB
Data RAM Size	160 kB
ADC Resolution	12 bit
Number of I/Os	122 I/O
Operating Supply Voltage	2.7 V to 5.5 V
Maximum Operating Temperature	+ 105 C
Packaging	Tray
Product	MCU
Program Memory Type	Flash
Data RAM Type	SRAM
Analog Supply Voltage	2.7 V to 5.5 V
DAC Resolution	10 bit
Minimum Operating Temperature	- 40 C
Number of ADC Channels	24 Channel
Number of Timers/Counters	16 x 24 bit
Processor Series	MB9B420TA
Factory Pack Quantity	152
Supply Voltage - Max	5.5 V
Supply Voltage - Min	2.7 V
Watchdog Timers	Watchdog Timer

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MB9B420TA Series

32-bit Arm

Cortex

-M3

FM3 Microcontroller

The MB9B420TA Series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with low-power consumption

mode and competitive cost.

These series are based on the Arm

Cortex

-M3 Processor with on-chip Flash memory and SRAM, and have peripheral functions

such as various timers, ADCs, DACs and Communication Interfaces (CAN, UART, CSIO, I

C, LIN).

The products which are described in this data sheet are placed into TYPE12 product categories in "FM3 Family Peripheral Manual".

Features

32-bit Arm

Cortex

-M3 Core



Processor version: r2p1



Up to 60 MHz Frequency Operation



Integrated Nested Vectored Interrupt Controller (NVIC):

1 NMI (non-maskable interrupt) and 48 peripheral interrupts

and 16 priority levels

management

CAN Interface



Compatible with CAN Specification 2.0A/B



Maximum transfer rate: 1 Mbps



Built-in 32 message buffer

Multi-function Serial Interface (Max 16 channels)



16 channels with 16 steps×9-bit FIFO



Operation mode is selectable from the followings for each

channel.



UART



CSIO



LIN





24-bit System timer (Sys Tick): System timer for OS task

On-chip Memories

[Flash memory]



Dual operation Flash memory



Main

area:

• Up to 1.5 Mbytes(1008 Kbytes(ROM0) + 512 Kbytes

(ROM1) of Upper bank and 16 Kbytes (ROM0) of Lower

bank.)



Work area

• 64 Kbytes(ROM1) of Lower bank

[UART]



Full duplex double buffer



Selection with or without parity supported



Built-in dedicated baud rate generator



External clock available as a serial clock



Hardware Flow control: Automatically control the

transmission/reception by CTS/RTS (only ch.4)

framing errors, and overrun errors)



Read cycle: 0 wait-cycle



Security function for code protection

[SRAM]

This Series on-chip SRAM is composed of two independent

SRAM (SRAM0, SRAM1). SRAM0 is connected to I-code bus

and D-code bus of Cortex-M3 core. SRAM1 is connected to

System bus.



Various error detection functions available (parity errors,

[CSIO]



Full duplex double buffer



Built-in dedicated baud rate generator



Overrun error detection function available

[LIN]



LIN protocol Rev.2.1 supported



Full duplex double buffer



Master/Slave mode supported



LIN break field generation (can be changed to 13 to 16-bit

length)



SRAM0: Up to 96 Kbytes



SRAM1: Up to 96 Kbytes

External Bus Interface



Supports SRAM, NOR NAND Flash memory device



Up to 8 chip selects



8-/16-bit Data width



Up to 25-bit Address bit



Maximum area size: Up to 256 Mbytes



Supports Address/Data multiplex



Supports external RDY function



LIN break delimiter generation (can be changed to 1 to 4-bit



Various error detection functions available (parity errors,

framing errors, and overrun errors)

Cypress Semiconductor Corporation

Document Number: 002-05663 Rev. *E

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised January 12, 2018

MB9B420TA Series

Contents

1. Product Lineup .................................................................................................................................................................. 7

2. Packages ........................................................................................................................................................................... 8

3. Pin Assignment ................................................................................................................................................................. 9

4. List of Pin Functions....................................................................................................................................................... 12

5. I/O Circuit Type................................................................................................................................................................ 53

6. Handling Precautions ..................................................................................................................................................... 59

6.1

Precautions for Product Design ................................................................................................................................... 59

6.2

Precautions for Package Mounting .............................................................................................................................. 60

6.3

Precautions for Use Environment ................................................................................................................................ 61

7. Handling Devices ............................................................................................................................................................ 62

8. Block Diagram ................................................................................................................................................................. 64

9. Memory Size .................................................................................................................................................................... 64

10. Memory Map .................................................................................................................................................................... 65

11. Pin Status in Each CPU State ........................................................................................................................................ 68

12. Electrical Characteristics ............................................................................................................................................... 76

12.1 Absolute Maximum Ratings ......................................................................................................................................... 76

12.2 Recommended Operating Conditions.......................................................................................................................... 78

12.3 DC Characteristics....................................................................................................................................................... 79

12.3.1 Current Rating .............................................................................................................................................................. 79

12.3.2 Pin Characteristics ....................................................................................................................................................... 82

12.4 AC Characteristics ....................................................................................................................................................... 83

12.4.1 Main Clock Input Characteristics .................................................................................................................................. 83

12.4.2 Sub Clock Input Characteristics ................................................................................................................................... 84

12.4.3 Built-in CR Oscillation Characteristics .......................................................................................................................... 85

12.4.4 Operating Conditions of Main PLL (In the case of using main clock for input of PLL) .................................................. 86

12.4.5 Operating Conditions of Main PLL (In the case of using built-in high-speed CR for input clock of main PLL).............. 86

12.4.6 Reset Input Characteristics .......................................................................................................................................... 87

12.4.7 Power-on Reset Timing................................................................................................................................................ 87

12.4.8 External Bus Timing ..................................................................................................................................................... 88

12.4.9 Base Timer Input Timing .............................................................................................................................................. 98

12.4.10 CSIO/UART Timing .................................................................................................................................................. 99

12.4.11 External Input Timing .............................................................................................................................................. 107

12.4.12 Quadrature Position/Revolution Counter timing ...................................................................................................... 108

12.4.13 I

C Timing ............................................................................................................................................................... 110

12.4.14 ETM Timing ............................................................................................................................................................ 111

12.4.15 JTAG Timing ........................................................................................................................................................... 112

12.5 12-bit A/D Converter .................................................................................................................................................. 113

12.6 10-bit D/A Converter .................................................................................................................................................. 116

12.7 Low-Voltage Detection Characteristics ...................................................................................................................... 117

12.7.1 Low-Voltage Detection Reset ..................................................................................................................................... 117

12.7.2 Interrupt of Low-Voltage Detection ............................................................................................................................. 118

12.8 Flash Memory Write/Erase Characteristics ............................................................................................................... 119

12.8.1 Write / Erase time....................................................................................................................................................... 119

12.8.2 Write cycles and data hold time ................................................................................................................................. 119

12.9 Return Time from Low-Power Consumption Mode .................................................................................................... 120

12.9.1 Return Factor: Interrupt/WKUP .................................................................................................................................. 120

Document Number: 002-05663 Rev. *E

Page 5 of 134

MB9BF428TABGL-GE1 Related Products

	MB9BF428TABGL-GE1	MB9BF429TAPMC-GE2
Description	ARM Microcontrollers - MCU MM MCU	ARM Microcontrollers - MCU MM MCU
Product Attribute	Attribute Value	Attribute Value
Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Product Category	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU
RoHS	Details	Details
Mounting Style	SMD/SMT	SMD/SMT
Package / Case	FBGA-192	LQFP-176
Core	ARM Cortex M3	ARM Cortex M3
Data Bus Width	32 bit	32 bit
Maximum Clock Frequency	60 MHz	60 MHz
Program Memory Size	1 MB	1.5 MB
Data RAM Size	160 kB	192 kB
ADC Resolution	12 bit	12 bit
Number of I/Os	122 I/O	154 I/O
Operating Supply Voltage	2.7 V to 5.5 V	2.7 V to 5.5 V
Maximum Operating Temperature	+ 105 C	+ 105 C
Packaging	Tray	Tray
Product	MCU	MCU
Program Memory Type	Flash	Flash
Data RAM Type	SRAM	SRAM
Analog Supply Voltage	2.7 V to 5.5 V	2.7 V to 5.5 V
DAC Resolution	10 bit	10 bit
Minimum Operating Temperature	- 40 C	- 40 C
Number of ADC Channels	24 Channel	24 Channel
Number of Timers/Counters	16 x 24 bit	16 x 24 bit
Processor Series	MB9B420TA	MB9B420TA
Factory Pack Quantity	152	1
Supply Voltage - Max	5.5 V	5.5 V
Supply Voltage - Min	2.7 V	2.7 V
Watchdog Timers	Watchdog Timer	Watchdog Timer

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