EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-T0303AS-03-8662-J

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-T0303AS-03-8662-J Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-T0303AS-03-8662-J - - View Buy Now

WBC-T0303AS-03-8662-J Overview

Resistor Networks & Arrays

WBC-T0303AS-03-8662-J Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics plc
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
[Repost] How to understand the high-frequency and low-frequency characteristics of components
[p=32, null, left][font=微软雅黑]Let's talk about capacitors first. It is said that large capacitors have good low-frequency characteristics, and small capacitors have good high-frequency characteristics....
皇华Ameya360 Power technology
MSP430 Watchdog Variables
If the program runs out of control, the watchdog will reset the program and start from the first line of the program, but the value of the variable will remain unchanged. Since some variables are cond...
zzbaizhi Microcontroller MCU
vsim-3812 Design is being optimized... Type mismatch for port
Development environment: ise 10.1 and modelsim 6.5se check syntax can be passed, and the following error occurs when simulating the project with modelsim: # vsim -lib work -t 1ps p46_example_4_2_tbw #...
innerpeace FPGA/CPLD
The Fluke Pocket Multimeter has arrived. Has everyone participated in the data update activity?
[font=微软雅黑] Have you all participated in the [url=https://bbs.eeworld.com.cn/thread-438798-1-1.html][b]Update your personal information to win surprise gifts[/b][/url] event? There are only 14 days le...
eric_wang Talking
Introduction to Digital Systems (Classic American Study Guide Series)
[b]Introduction[/b]: [b]Contents:[/b] This book is a tutorial for digital circuits. It mainly introduces some practical design methods that can effectively solve digital circuit problems. The book has...
tiankai001 MCU
Urgent, need help with my graduation project. DM6446, SDRAM, data verification failed when loading program
I am in a hurry to finish my graduation project. Please give me some advice. Thank you very much. DM6446, only using DSP. In cmd file, each segment is defined in SDRAM. There is no error in compilatio...
txdaaron DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 308  2106  1915  2678  1459  7  43  39  54  30 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号