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L17TF2501100

Description
D-Sub Standard Connectors D-SUB PRESS-FIT
CategoryThe connector   
File Size2MB,4 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
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L17TF2501100 Overview

D-Sub Standard Connectors D-SUB PRESS-FIT

L17TF2501100 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerAmphenol
Product CategoryD-Sub Standard Connectors
RoHSDetails
Number of Positions25 Position
Number of Rows2 Row
Shell Size3 (B)
PackagingTray
Insert ArrangementB25
Factory Pack Quantity50
TF
D-Sub connectors - Stamped and Formed Contacts
PRESS FIT
STRAIGHT PCB TERMINATION
CHARACTERISTICS
Materials and Platings
Shells
Insulator
Pin contact
Steel, tin plated
Glass-filled thermoplastic, UL 94V-0
Brass, selected gold in mating area;
2.54µm (100µ") min. tin
on termination area over
1.27µm (50µ") min.nickel
Phosphor bronze, selected gold in
mating area; 2.54µm (100µ") min.
tin on termination area over;
1.27µm(50µ") min. nickel
Brass, 2.54µm (100µ") min. nickel plated
Brass, 2.54µm (100µ") min. nickel plated
Brass, 2.54µm (100µ") min. nickel plated
DESCRIPTION
APPLICATIONS
The Amphenol “TF“ series
features eye of needle formed
contacts, and insulator with
closed entry contacts cavities.
This series gives you
Amphenol's high standards of
quality and reliability to meet
all your technical requirements.
Socket contact
Rear insert
Boardlock
Screwlock
Electrical Data
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
3A
300V AC
1000V AC/rms 60Hz for one minute
1000MΩ
25mΩ max
Climatic Data
Operating temperature
-55°C to +125°C
Salt spray
24 hours
Solderless
straight PCB
mount
connectors
• Industrial
• Telecom
• Any backplanes
connections
Mechanical Data
Single contact insertion force
Single contact withdrawal force
Single contact insertion on board
Single contact withdrawal from board
Standard plating thickness
≤ 3.60 N
≥ 0.2 N
≤ 100 N
≥ 20 N
Gold flash
0.4µm (15µ") gold
0.76µm (30µ") gold
Terminal
Specification
Finished Hole
Cu
Sn
1 (+0.09 -0.06)
> 25 µm
< 15 µm
Boardlock
Specification
3.1 +/- 0.05
mm
Min 25 µm
5-15 µm
TF / E4
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