|
TC514800AFTLL-70 |
TC514800AJLL |
TC514800AJLL-70 |
TC514800AJLL-80 |
TC514800AFTLL-80 |
| Description |
524288 WORD X 8 BIT DYNAMIC RAM |
524288 WORD X 8 BIT DYNAMIC RAM |
524288 WORD X 8 BIT DYNAMIC RAM |
524288 WORD X 8 BIT DYNAMIC RAM |
524288 WORD X 8 BIT DYNAMIC RAM |
| Is it lead-free? |
Contains lead |
- |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
incompatible |
| Maker |
Toshiba Semiconductor |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
| Parts packaging code |
TSOP |
- |
SOJ |
SOJ |
TSOP |
| package instruction |
TSOP2, |
- |
SOJ, |
SOJ, |
TSOP2, |
| Contacts |
28 |
- |
28 |
28 |
28 |
| Reach Compliance Code |
unknow |
- |
unknow |
unknow |
unknow |
| access mode |
FAST PAGE |
- |
FAST PAGE |
FAST PAGE |
FAST PAGE |
| Maximum access time |
70 ns |
- |
70 ns |
80 ns |
80 ns |
| Other features |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
- |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
| JESD-30 code |
R-PDSO-G28 |
- |
R-PDSO-J28 |
R-PDSO-J28 |
R-PDSO-G28 |
| JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
| length |
18.41 mm |
- |
18.42 mm |
18.42 mm |
18.41 mm |
| memory density |
4194304 bi |
- |
4194304 bi |
4194304 bi |
4194304 bi |
| Memory IC Type |
FAST PAGE DRAM |
- |
FAST PAGE DRAM |
FAST PAGE DRAM |
FAST PAGE DRAM |
| memory width |
8 |
- |
8 |
8 |
8 |
| Number of functions |
1 |
- |
1 |
1 |
1 |
| Number of ports |
1 |
- |
1 |
1 |
1 |
| Number of terminals |
28 |
- |
28 |
28 |
28 |
| word count |
524288 words |
- |
524288 words |
524288 words |
524288 words |
| character code |
512000 |
- |
512000 |
512000 |
512000 |
| Operating mode |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
- |
70 °C |
70 °C |
70 °C |
| organize |
512KX8 |
- |
512KX8 |
512KX8 |
512KX8 |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSOP2 |
- |
SOJ |
SOJ |
TSOP2 |
| Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, THIN PROFILE |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
| refresh cycle |
1024 |
- |
1024 |
1024 |
1024 |
| Maximum seat height |
1.2 mm |
- |
3.7 mm |
3.7 mm |
1.2 mm |
| self refresh |
YES |
- |
YES |
YES |
YES |
| Maximum supply voltage (Vsup) |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
- |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
5 V |
5 V |
| surface mount |
YES |
- |
YES |
YES |
YES |
| technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
- |
J BEND |
J BEND |
GULL WING |
| Terminal pitch |
1.27 mm |
- |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
- |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
10.16 mm |
- |
10.16 mm |
10.16 mm |
10.16 mm |