524288 WORD X 8 BIT DYNAMIC RAM
| TC514800AJLL | TC514800AFTLL-70 | TC514800AJLL-70 | TC514800AJLL-80 | TC514800AFTLL-80 | |
|---|---|---|---|---|---|
| Description | 524288 WORD X 8 BIT DYNAMIC RAM | 524288 WORD X 8 BIT DYNAMIC RAM | 524288 WORD X 8 BIT DYNAMIC RAM | 524288 WORD X 8 BIT DYNAMIC RAM | 524288 WORD X 8 BIT DYNAMIC RAM |
| Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | - | TSOP | SOJ | SOJ | TSOP |
| package instruction | - | TSOP2, | SOJ, | SOJ, | TSOP2, |
| Contacts | - | 28 | 28 | 28 | 28 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow |
| access mode | - | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| Maximum access time | - | 70 ns | 70 ns | 80 ns | 80 ns |
| Other features | - | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
| JESD-30 code | - | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-G28 |
| JESD-609 code | - | e0 | e0 | e0 | e0 |
| length | - | 18.41 mm | 18.42 mm | 18.42 mm | 18.41 mm |
| memory density | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
| Memory IC Type | - | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| memory width | - | 8 | 8 | 8 | 8 |
| Number of functions | - | 1 | 1 | 1 | 1 |
| Number of ports | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | 28 | 28 | 28 | 28 |
| word count | - | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | - | 512000 | 512000 | 512000 | 512000 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | - | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | TSOP2 | SOJ | SOJ | TSOP2 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | - | 1024 | 1024 | 1024 | 1024 |
| Maximum seat height | - | 1.2 mm | 3.7 mm | 3.7 mm | 1.2 mm |
| self refresh | - | YES | YES | YES | YES |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | YES | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | GULL WING | J BEND | J BEND | GULL WING |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
京公网安备 11010802033920号
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